Tungsten/Copper Diffusion Bonding Guided by Vacuum Deposited Cu-Ni-Fe Coating AITranslate
Abstract AITranslate
Cu-Ni-Fe coating was prepared on the surface of pure tungsten by vacuum deposition,and the dif fusion bonding of pure tungsten and copper was carried out with the coating as the middle layer. The mi crostructure and composition distribution at the interface of the W/Cu-Ni-Fe coating/Cu joint were investigated by OM, SEM, EDS, microhardness tester and shear test. The results show that at the interface of vacuum deposited W/Cu-Ni-Fe coating,a large number of W atoms go into the Cu-Ni-Fe coating by reaction diffusion to form a 6μm wide FeW-rich interracial layer. At the Cu-Ni-Fe coating/Cu interface formed during diffusion bonding, the microstructure is homogeneous and compact but copper base metal has a small amount of micropores. The shear strength of the W/Cu-Ni-Fe coating/Cu joint reaches 185 MPa,and fracture failure occurs mainly in tungsten base metal and FeW-rich interracial layer.
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Basic Information:
DOI：
Chinese Library Classification Number:TG457.19[金属学及工艺—焊接]
Citation Information:
Cu-Ni-Fe coating was prepared on the surface of pure tungsten by vacuum deposition,and the dif fusion bonding of pure tungsten and copper was carried out with the coating as the middle layer. The mi crostructure and composition distribution at the interface of the W/Cu-Ni-Fe coating/Cu joint were investigated by OM, SEM, EDS, microhardness tester and shear test. The results show that at the interface of vacuum deposited W/Cu-Ni-Fe coating,a large number of W atoms go into the Cu-Ni-Fe coating by reaction diffusion to form a 6μm wide FeW-rich interracial layer. At the Cu-Ni-Fe coating/Cu interface formed during diffusion bonding, the microstructure is homogeneous and compact but copper base metal has a small amount of micropores. The shear strength of the W/Cu-Ni-Fe coating/Cu joint reaches 185 MPa,and fracture failure occurs mainly in tungsten base metal and FeW-rich interracial layer.
quote
| GB/T 7714-2015 | [1] YANG Zong-hui, SHEN Yi-fu, LI Xiao-quan. Tungsten/Copper Diffusion Bonding Guided by Vacuum Deposited Cu-Ni-Fe Coating[J]. Rare Metals and Cemented Carbides, 2012(6): 60-63. |
| MLA | [1] YANG Zong-hui, et al., "Tungsten/Copper Diffusion Bonding Guided by Vacuum Deposited Cu-Ni-Fe Coating." Rare Metals and Cemented Carbides, no. 6, 2012, pp. 60-63. |
| APA | [1] YANG Zong-hui, SHEN Yi-fu, & LI Xiao-quan. (2012). Tungsten/Copper Diffusion Bonding Guided by Vacuum Deposited Cu-Ni-Fe Coating. Rare Metals and Cemented Carbides(6), 60-63. |
| IEEE | [1] YANG Zong-hui, SHEN Yi-fu, and LI Xiao-quan, "Tungsten/Copper Diffusion Bonding Guided by Vacuum Deposited Cu-Ni-Fe Coating," Rare Metals and Cemented Carbides, no. 6, pp. 60-63, 2012. keywords: {vacuum deposition;tungsten;tungsten/copper diffusion bonding;Cu-Ni-Fe coating} |