Electroless Copper Deposition Performance for Printed Circuit Board with Magnetic Field
Chinese Journal of Rare Metals | Vol., Issue 12, 2025 |
pp. 1837-1846
Printed circuit boards (PCBs), serving as critical carriers for electrical interconnections
among numerous electronic components, are widely employed in computers, communications,
aerospace, and medical applications. Electroless copper deposition is a key step in
PCB manufacturing, involving the chemical deposition of a thin copper layer (2~3 μm)
on the insulating via walls to establish conductive interconnections between different
circuit layers or copper foils. The quality of this deposited copper layer directly
determines the electrical connectivity performance of PCB. However, due to limitations
in production equipment capabilities or outdated electroless copper plating technology,
defects such as copper voids on via walls, rough copper surfaces, uneven copper thickness,
microcracks, and poor copper adhesion may occur. During soldering or normal operational
life cycles, PCBs are subjected to high-temperature reflow soldering or repeated thermal
cycling, imposing stringent requirements on the uniformity, surface roughness, adhesion
strength, and thermal shock resistance of the deposited copper layer. These challenges
drive manufacturers to continuously explore methods for achieving stable and reliable
electroless copper deposition. Extensive research has been conducted by scholars worldwide
to investigate the influence of magnetic fields on the physicochemical properties
of materials. It has been well-documented that external magnetic fields can exert
directional control over the deposition rate, surface morphology, and crystal growth
orientation in chemical deposition processes. In this study, electroless copper plating
was conducted on Flame Retardant 4(FR-4) substrates under different magnetic fields
with central intensities of 30 and 60 mT. The copper deposition rate was measured
gravimetrically, while scanning electron microscopy (SEM) was employed to analyze
the microstructure of deposited copper layers. Cyclic voltammetry (CV) and electrochemical
impedance spectroscopy (EIS) were utilized to investigate the effects of magnetic
fields on deposition processes at different copper ion concentrations and the resulting
corrosion resistance. The results indicated that the copper deposition rate peaked
at approximately 2.5 min before stabilizing. During the stable phase, the applied
magnetic field increased the deposition rate from 8 to 10 mg·dm−2·min−1, representing a 25% enhancement. The plating tank size significantly influenced the
deposition rate during the pre-peak phase, with smaller tanks yielding higher peak
rates. Visual and SEM observation revealed that magnetic field-assisted deposition
produced brighter, smoother, and more uniform copper layers with improved density.
While negligible effects were observed at low copper ion concentrations (<1 g·L−1), significant changes occurred at 2~5 g·L−1 concentrations under magnetic fields:increased cathodic polarization accompanied
by negative shifts in deposition potential peaks, with the shift magnitude being concentration-dependent.
Specifically, at 60 mT, the reduction peak potential for 5 g·L−1 copper solution shifted from –0.85 to –0.89 V, with current density increasing from
2.11 to 2.34 A·dm−2. EIS analysis confirmed that magnetic field-deposited copper layers exhibited higher
charge transfer resistance during electrochemical corrosion, indicating superior corrosion
resistance.
DOI: 10.13373/j.cnki.cjrm.XY25040023 Cited: 0 Download: 0
