Phase diagram of Ag–Pb–Sn system AITranslate
Abstract AITranslate
The Ag–Pb–Sn ternary system is an important material system for both electronic packaging and thermoelectric applications. However, there is no experimental phase equilibria information of the ternary system. Ag–Pb–Sn alloys are prepared and their phase equilibria at various temperatures were determined. The focus was on the 500, 350, and 200 °C isothermal sections. Additional information was also obtained for 400, and 300 °C. Several samples were studied by DSC studies. No ternary compounds were found in the ternary system. The Ag–Sn binary compounds, Ag3Sn(ε) and Ag4Sn(ζ) at 350 °C and Ag4Sn(ζ) at 500 °C, exhibit very small Pb solubility. The thermodynamic assessment of the ternary Ag–Pb–Sn system was carried out using the above mentioned experimental data.
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DOI:https://doi.org/10.1016/j.calphad.2020.101997
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The Ag–Pb–Sn ternary system is an important material system for both electronic packaging and thermoelectric applications. However, there is no experimental phase equilibria information of the ternary system. Ag–Pb–Sn alloys are prepared and their phase equilibria at various temperatures were determined. The focus was on the 500, 350, and 200 °C isothermal sections. Additional information was also obtained for 400, and 300 °C. Several samples were studied by DSC studies. No ternary compounds were found in the ternary system. The Ag–Sn binary compounds, Ag3Sn(ε) and Ag4Sn(ζ) at 350 °C and Ag4Sn(ζ) at 500 °C, exhibit very small Pb solubility. The thermodynamic assessment of the ternary Ag–Pb–Sn system was carried out using the above mentioned experimental data.
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| GB/T 7714-2015 | [1] Jiayu Du, Adéla Zemanová, Yohanes Hutabalian, et al. Calphad, 2020(71). DOI:10.1016/j.calphad.2020.101997. |
| MLA | [1] Jiayu Du, et al., Calphad, no. 71, 2020, https://doi.org/10.1016/j.calphad.2020.101997. |
| APA | [1] Jiayu Du, Adéla Zemanová, Yohanes Hutabalian, Aleš Kroupa, & Sinnwen Chen. (2020). Calphad(71). https://doi.org/10.1016/j.calphad.2020.101997 |
| IEEE | [1] Jiayu Du, Adéla Zemanová, Yohanes Hutabalian, Aleš Kroupa, and Sinnwen Chen, Calphad, no. 71, 2020, doi: 10.1016/j.calphad.2020.101997. |
