Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder AITranslate
Abstract AITranslate
Study is made of the influence of RE elements of Ce,Er,Y and Sc on the physical property, wetting property and mechanical property of Sn-Ag-Cu alloy with Sn-3.0Ag-0.5Cu-based solder as master alloy. The test results show that rare earth elements would affect in different way the property of the solder. The addition of trace rare earth Ce in the solder can further improve the property.
KeyWords AITranslate
1Katsuaki Suganuma.Advances in lead-free electronics soldering[J].Current Opinion in Solid State and Materials Science,2001,5(1):55-64.
2刘静,张富文.微电子互连锡基无铅焊料的发展[J].稀有金属快报,2005,24(4):6-12. 被引量:9
3Wu C M L.Properties of lead-free solder alloys with rare earth element additions[J].Materials Science and Engineering R,2004,44(1):1-4.
4沈骏,刘永长,张培珍,高后秀.无铅焊料研究现状与发展展望[J].功能材料,2004,35(4):403-406. 被引量:17
5薛松柏,刘琳,代永峰,姚立华.微量稀土元素铈对Sn-Ag-Cu无铅钎料物理性能和焊点抗拉强度的影响[J].焊接学报,2005,26(10):23-26. 被引量:25
6邱小明,李世权,万传庚,赵旭日.稀土对锡铅钎料润湿性和接头强度的影响[J].吉林工业大学学报,1994,24(4):73-77. 被引量:10
7Yu D Q.Improvement on the microstructure stability,mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds,2004,376(1-2):170-175.
1陈文学,薛松柏,王慧,韩宗杰.合金元素Ga对Sn-9Zn无铅钎料性能的影响[J].焊接学报,2008,29(4):37-40. 被引量:15
2沈艳兰,顾小龙,徐时清,金霞.Ce的添加对SnAgCu系钎料组织和性能的影响[J].中国计量学院学报,2011,22(2):194-197. 被引量:4
3张宇航,卢斌,戴贤斌,罗时中,赵四勇,孙福林,高承仲.Ce对SnAgCu系无铅焊料合金组织和性能的影响[J].材料研究与应用,2007,1(4):295-299. 被引量:11
4董文兴,史耀武,雷永平,夏志东,郭福.镍磷锗对SnAgCuCe系钎料性能及组织的影响[J].电子元件与材料,2008,27(10):70-73.
5薛鹏,薛松柏,沈以赴,叶焕,肖正香.Sn-9Zn-xPr钎料钎焊性能及显微组织[J].焊接学报,2011,32(8):53-56. 被引量:7
6刘文胜,邓涛,马运柱,彭芬,黄国基.稀土元素对无铅焊料性能的影响[J].材料科学与工程学报,2011,29(5):800-805. 被引量:6
7张亮,韩继光,郭永环,赖忠民,张亮.SnAgCu/SnAgCuCe焊点的显微组织与性能[J].机械工程学报,2012,48(8):67-73. 被引量:11
8张宇航,高瑞军,孙福林,韩振峰,潘凯华,钟茂山.Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响[J].材料研究与应用,2014,8(1):35-38. 被引量:5
9杨艳艳,晏建武,刘国亮,曹清华,张丽玲.稀土元素镧和锶对镍基钎焊料焊接性能的影响[J].南昌工程学院学报,2014,33(6):27-30. 被引量:3
10高瑞军,张宇航,康宇,韩振峰,孙福林,钟茂山.合金元素Ag含量对Sn-Ag-Cu无铅焊料焊接性能的影响[J].材料研究与应用,2015,9(2):112-115.
1沈艳兰,顾小龙,徐时清,金霞.Ce的添加对SnAgCu系钎料组织和性能的影响[J].中国计量学院学报,2011,22(2):194-197. 被引量:4
2潘君益,金霞,沈艳兰.稀土元素对SnAgCu系无铅钎料合金组织与性能的影响[J].焊接技术,2013,42(3):31-34.
3王慧,薛松柏,陈文学,王俭辛.复合添加Ga,Al,Ag对Sn-9Zn钎料性能的影响[J].焊接学报,2009,30(6):21-24. 被引量:3
4叶焕,薛松柏,张亮,皋利利,曾广.稀土元素对SnAgCu钎料性能的影响[J].电焊机,2009,39(10):90-96.
5薛松柏,王慧,陈文学,顾立勇,顾文华.Sn-Zn系无铅钎料研究中的几个热点问题[J].焊接,2010(1):56-60. 被引量:2
6易江龙,张宇鹏,许磊,刘凤美,杨凯珍.混合稀土对Sn-0.70Cu-0.05Ni钎料组织与性能的影响[J].电子元件与材料,2011,30(2):25-28. 被引量:8
7池水莲,周俊生.新型低成本无铅钎料的研究进展[J].焊接技术,2012,41(3):1-5.
8李阳,薛松柏,杨晶秋,叶焕,陈澄,顾立勇,顾文华.Sn-Zn-Ga-xPr钎料组织与性能[J].焊接学报,2012,33(5):33-36. 被引量:3
9周俊生,池水莲,修建国.合金元素添加对锡基无铅钎料性能的影响[J].热加工工艺,2012,41(11):163-166. 被引量:1
10陈澄,薛松柏,杨晶秋,叶焕,李阳.Pr元素对Sn-Zn-Ga钎料锡须生长的影响[J].焊接学报,2012,33(7):69-72. 被引量:2
1张莎莎,张亦杰,马乃恒,王浩伟.Sn-Ag-Cu系无铅焊料性能研究进展[J].热加工工艺,2010,39(1):124-127. 被引量:11
2刘艳斌,吴本生,杨晓华.Sn-Ag-Cu系无铅焊料的显微组织与性能[J].理化检验:物理分册,2007,43(6):279-281. 被引量:2
3薛松柏,禹胜林.微米Sn-Ag-Cu-RE粉体材料的制备与表征[J].焊接学报,2004,25(6):1-3. 被引量:6
4彭敏,王英敏,张新房,羌建兵,李德俊,董闯.低熔点Sn-Ag-Cu合金成分的优化[J].电子工艺技术,2004,25(1):13-16. 被引量:5
5杨英慧.无铅焊料及焊接工艺[J].现代材料动态,2003(1):12-13.
6赵小艳,赵麦群,白艳霞,王秀春,王娅辉.Sn-Ag-Cu系无铅焊锡的力学性能和实用性能[J].电子元件与材料,2006,25(10):30-33. 被引量:3
7LI Guo-yuan,SHI Xun-qing.Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints[J].中国有色金属学会会刊:英文版,2006,16(B02):739-743. 被引量:16
8张富文,刘静,杨福宝,胡强,贺会军,徐骏.Sn-Ag-Cu无铅焊料的发展现状与展望[J].稀有金属,2005,29(5):619-624. 被引量:26
9张宇航,卢斌,戴贤斌,罗时中,赵四勇,孙福林,高承仲.Ce对SnAgCu系无铅焊料合金组织和性能的影响[J].材料研究与应用,2007,1(4):295-299. 被引量:11
10Katsuaki Suganuma.无铅电子封装发展现状[J].电子工业专用设备,2004,33(12):8-14. 被引量:6
Basic Information:
DOI:
Chinese Library Classification Number:TG454[金属学及工艺—焊接]
Citation Information:
Study is made of the influence of RE elements of Ce,Er,Y and Sc on the physical property, wetting property and mechanical property of Sn-Ag-Cu alloy with Sn-3.0Ag-0.5Cu-based solder as master alloy. The test results show that rare earth elements would affect in different way the property of the solder. The addition of trace rare earth Ce in the solder can further improve the property.
quote
| GB/T 7714-2015 | [1] LU Bin, LI Hui, WANG Juan-hui, et al. Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder[J]. Rare Metals and Cemented Carbides, 2007(1): 27-30. |
| MLA | [1] LU Bin, et al., "Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder." Rare Metals and Cemented Carbides, no. 1, 2007, pp. 27-30. |
| APA | [1] LU Bin, LI Hui, WANG Juan-hui, & ZHANG Yu-hang. (2007). Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder. Rare Metals and Cemented Carbides(1), 27-30. |
| IEEE | [1] LU Bin, LI Hui, WANG Juan-hui, and ZHANG Yu-hang, "Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder," Rare Metals and Cemented Carbides, no. 1, pp. 27-30, 2007. keywords: {lead-free solder;Sn-Ag-Cu;rare earth elements;property} |
