Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material AITranslate
Abstract AITranslate
Effect of annealing technology on the mechanical properties and physical properties of rolled CPC electronic composite packaging material was investigated in this paper. The results show that annealing technology has an important effect on the properties, including shear strength of the interface, rolling direction electric conductivity and through-thickness thermal conductivity of the composite material. The CPC electronic packaging materials have the best integrated properties when annealed under the temperature of 900 ℃ for 1.5 hours.
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1喻学斌,吴人洁,张国定.金属基电子封装复合材料的研究现状及发展[J].材料导报,1994(3):64-66. 被引量：56
2王海山,王志法,姜国圣,肖学章,莫文剑.退火温度对轧制复合Cu/Mo/Cu电子封装材料性能的影响[J].金属热处理,2004,29(5):17-20. 被引量：10
3彭大暑,刘浪飞,朱旭霞.金属层状复合材料的研究状况与展望[J].材料导报,2000,14(4):23-24. 被引量：54
4王海山,王志法,姜国圣,杨会娟,莫文剑.加工参数对轧制复合Cu/Mo/Cu电子封装材料性能的影响[J].材料保护,2004,37(10):60-62. 被引量：3
5Menna L.Diffusion annealing of copper-silver bimetallic strips at different temperatures[J].Materials Characterization,2001,47:269.
6李河宗,李玉刚,于九明,黄素霞.不锈钢和铝固相轧制复合的结合机理[J].河北理工学院学报,2002,24(2):25-28. 被引量：4
7于宝义,齐克敏,安振之.铜-钢-铜三层复合板室温轧制成形工艺及结合机制的研究[J].热加工工艺,2001,30(3):34-36. 被引量：16
1赵志国,张立文,张兆彪,李元冀,张福瑞,高峰,高守义.MoCu球铁激光淬火过程温度场的数值计算[J].大连理工大学学报,1995,35(2):164-169. 被引量：7
2亢占英,陈文革,丁秉钧.溶胶-凝胶法制备纳米MoCu复合粉体[J].稀有金属材料与工程,2005,34(6):990-993. 被引量：4
3L. W. Zhang, J. Th.M.De Hosson, Y.L. Xia and F. G. Wang 1)The State Key Lab. for Materials Modification by Laser, Ion and Beams, Dalian University of Technology, Dalian 116023, China 2)Department of Applied Physics, University of Froningen, The Netherlan.CALCULATION OF RESIDUAL STRESS FIELD IN LASER TRANSFORMATION HARDENED MoCu NODULAR IRON[J].金属学报：英文版,2000,0(2):776-779. 被引量：1
4郑秋波,王志法,姜国圣,崔大田,吴泓.电子封装用CPC新型层状复合材料的研制[J].中国钼业,2005,29(6):41-44. 被引量：5
5王光宗,郭宏,尹法章,张习敏,韩媛媛,范叶明.钼铜的低温导热研究[J].热加工工艺,2012,41(16):13-15. 被引量：1
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DOI：
Chinese Library Classification Number:TG113.2[金属学及工艺—物理冶金]
Citation Information:
Effect of annealing technology on the mechanical properties and physical properties of rolled CPC electronic composite packaging material was investigated in this paper. The results show that annealing technology has an important effect on the properties, including shear strength of the interface, rolling direction electric conductivity and through-thickness thermal conductivity of the composite material. The CPC electronic packaging materials have the best integrated properties when annealed under the temperature of 900 ℃ for 1.5 hours.
quote
| GB/T 7714-2015 | [1] WU Hong, WANG Zhi-fa, JIANG Guo-sheng. Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material[J]. Rare Metals and Cemented Carbides, 2007(1): 22-26. |
| MLA | [1] WU Hong, et al., "Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material." Rare Metals and Cemented Carbides, no. 1, 2007, pp. 22-26. |
| APA | [1] WU Hong, WANG Zhi-fa, & JIANG Guo-sheng. (2007). Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material. Rare Metals and Cemented Carbides(1), 22-26. |
| IEEE | [1] WU Hong, WANG Zhi-fa, and JIANG Guo-sheng, "Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material," Rare Metals and Cemented Carbides, no. 1, pp. 22-26, 2007. keywords: {electronic packaging material CPC rolled composite annealing MoCu} |