Thermal Deformation Behavior and Microstructural Evolution of Cu-2.8Be Alloy for Secondary Electron Emission Applications AITranslate

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Chinese Library Classification Number:TG146.24[一般工业技术]

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The flow stress behavior and microstructural evolution of Cu-2.8Be alloy for secondary electron emission applications were investigated through hot compression tests and electron backscatter diffraction(EBSD)analysis within the temperature range of 680~830℃and strain rate range of 0.01~10 s^-1.A hot processing map was established based on the Arrhenius constitutive equation and dynamic materials model,revealing the optimal processing window at 770~830℃with a logarithmic strain rate range from-1.0 to 0.25.The calculated thermal activation energy(Q)of the alloy is 231.17 kJ/mol.EBSD analysis shows that higher strain rates shorten recrystallized grain growth time,leading to progressive grain refinement.Meanwhile,enhanced work hardening and dislocation density promote particle-stimulated nucleation,thereby increasing dynamic recrystallization(DRX)degree.As a result,the deformed alloy microstructure exhibits an increased proportion of high-angle grain boundaries along with a reduction in average dislocation density and kernel average misorientation(KAM).