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Analysis and simulation of high-power LED array with microchannel heat sink AITranslate

Xin Zhang; RuChun Li; Qi Zheng
Zhejiang University of Technology; Zhejiang University of Technology; Zhejiang University of Technology
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Publisher: Springer Nature
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Abstract AITranslate

The high power light emitting diode (LED) array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resistance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis. Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resistance is 0.019 W/°C.

KeyWords AITranslate

Highpower LED array Microchannel heat sink Thermal resistance Analytical solution Optimized simulation
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Basic Information:

DOI：https://doi.org/10.1007/s40436-013-0027-0

Chinese Library Classification Number:

Citation Information:

The high power light emitting diode (LED) array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resistance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis. Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resistance is 0.019 W/°C.

quote

GB/T 7714-2015 [1] Xin Zhang, RuChun Li, Qi Zheng. Advances in Manufacturing, 2013(1). DOI:10.1007/s40436-013-0027-0.
MLA [1] Xin Zhang, et al., Advances in Manufacturing, no. 1, 2013, https://doi.org/10.1007/s40436-013-0027-0.
APA [1] Xin Zhang, RuChun Li, & Qi Zheng. (2013). Advances in Manufacturing(1). https://doi.org/10.1007/s40436-013-0027-0
IEEE [1] Xin Zhang, RuChun Li, and Qi Zheng, Advances in Manufacturing, no. 1, 2013, doi: 10.1007/s40436-013-0027-0. keywords: {Highpower LED array;Microchannel heat sink;Thermal resistance;Analytical solution;Optimized simulation}