Self-Heating Effect in a MoS2 Field-Effect Transistor and Improved Heat Dissipation by the BN Capping Layer Self-Heating Effect in a MoS2 Field-Effect Transistor and Improved Heat Dissipation by the BN Capping Layer AITranslate
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The inefficient heat dissipation in two-dimensional (2D) semiconductor-based field-effect transistors (FETs) hampers their electrical performance and reliability. In this study, we address this issue by experimentally investigating the factors influencing the self-heating of MoS2-based 2D FETs and enhancing the heat dissipation of MoS2-based 2D FETs using a high thermal conductivity BN capping layer. The results demonstrate a significant reduction in the negative differential resistance (NDR) with 2D BN encapsulation, leading to improved electrical properties, such as increased saturation current density (average increase of 15.42%, maximum increase of 42%), and device saturation power density (average increase of 15.77%). This research sheds light on the self-heating effect in 2D FET devices and provides valuable insights for enhancing heat dissipation in 2D FETs through the use of high thermal conductivity insulator capping materials.
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DOI:https://doi.org/10.1021/acsaelm.3c01469
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The inefficient heat dissipation in two-dimensional (2D) semiconductor-based field-effect transistors (FETs) hampers their electrical performance and reliability. In this study, we address this issue by experimentally investigating the factors influencing the self-heating of MoS2-based 2D FETs and enhancing the heat dissipation of MoS2-based 2D FETs using a high thermal conductivity BN capping layer. The results demonstrate a significant reduction in the negative differential resistance (NDR) with 2D BN encapsulation, leading to improved electrical properties, such as increased saturation current density (average increase of 15.42%, maximum increase of 42%), and device saturation power density (average increase of 15.77%). This research sheds light on the self-heating effect in 2D FET devices and provides valuable insights for enhancing heat dissipation in 2D FETs through the use of high thermal conductivity insulator capping materials.
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| GB/T 7714-2015 | [1] Weiqi Dang, Ying Huangfu, Mongur Hossain, et al. ACS Applied Electronic Materials, 2024(6). DOI:10.1021/acsaelm.3c01469. |
| MLA | [1] Weiqi Dang, et al., ACS Applied Electronic Materials, no. 6, 2024, https://doi.org/10.1021/acsaelm.3c01469. |
| APA | [1] Weiqi Dang, Ying Huangfu, Mongur Hossain, Xiaohui Lin, Zheyi Lu, Ziwei Huang, Zhiwei Li, Yuan Liu, & Xidong Duan. (2024). ACS Applied Electronic Materials(6). https://doi.org/10.1021/acsaelm.3c01469 |
| IEEE | [1] Weiqi Dang, Ying Huangfu, Mongur Hossain, Xiaohui Lin, Zheyi Lu, Ziwei Huang, Zhiwei Li, Yuan Liu, and Xidong Duan, ACS Applied Electronic Materials, no. 6, 2024, doi: 10.1021/acsaelm.3c01469. keywords: {selfheating MoS2 FET NDR effect BN encapsulation heat dissipation} |
