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Self-Heating Effect in a MoS2 Field-Effect Transistor and Improved Heat Dissipation by the BN Capping Layer Self-Heating Effect in a MoS2 Field-Effect Transistor and Improved Heat Dissipation by the BN Capping Layer AITranslate

Hunan University; Hunan University; University of Stuttgart; Hunan University; Hunan University; Hunan University; Hunan University; Hunan University; Hunan University
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Publisher: ACS
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Abstract AITranslate

The inefficient heat dissipation in two-dimensional (2D) semiconductor-based field-effect transistors (FETs) hampers their electrical performance and reliability. In this study, we address this issue by experimentally investigating the factors influencing the self-heating of MoS2-based 2D FETs and enhancing the heat dissipation of MoS2-based 2D FETs using a high thermal conductivity BN capping layer. The results demonstrate a significant reduction in the negative differential resistance (NDR) with 2D BN encapsulation, leading to improved electrical properties, such as increased saturation current density (average increase of 15.42%, maximum increase of 42%), and device saturation power density (average increase of 15.77%). This research sheds light on the self-heating effect in 2D FET devices and provides valuable insights for enhancing heat dissipation in 2D FETs through the use of high thermal conductivity insulator capping materials.

KeyWords AITranslate

selfheating MoS2 FET NDR effect BN encapsulation heat dissipation
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Basic Information:

DOI:https://doi.org/10.1021/acsaelm.3c01469

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Citation Information:

The inefficient heat dissipation in two-dimensional (2D) semiconductor-based field-effect transistors (FETs) hampers their electrical performance and reliability. In this study, we address this issue by experimentally investigating the factors influencing the self-heating of MoS2-based 2D FETs and enhancing the heat dissipation of MoS2-based 2D FETs using a high thermal conductivity BN capping layer. The results demonstrate a significant reduction in the negative differential resistance (NDR) with 2D BN encapsulation, leading to improved electrical properties, such as increased saturation current density (average increase of 15.42%, maximum increase of 42%), and device saturation power density (average increase of 15.77%). This research sheds light on the self-heating effect in 2D FET devices and provides valuable insights for enhancing heat dissipation in 2D FETs through the use of high thermal conductivity insulator capping materials.

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GB/T 7714-2015 [1] Weiqi Dang, Ying Huangfu, Mongur Hossain, et al. ACS Applied Electronic Materials, 2024(6). DOI:10.1021/acsaelm.3c01469.
MLA [1] Weiqi Dang, et al., ACS Applied Electronic Materials, no. 6, 2024, https://doi.org/10.1021/acsaelm.3c01469.
APA [1] Weiqi Dang, Ying Huangfu, Mongur Hossain, Xiaohui Lin, Zheyi Lu, Ziwei Huang, Zhiwei Li, Yuan Liu, & Xidong Duan. (2024). ACS Applied Electronic Materials(6). https://doi.org/10.1021/acsaelm.3c01469
IEEE [1] Weiqi Dang, Ying Huangfu, Mongur Hossain, Xiaohui Lin, Zheyi Lu, Ziwei Huang, Zhiwei Li, Yuan Liu, and Xidong Duan, ACS Applied Electronic Materials, no. 6, 2024, doi: 10.1021/acsaelm.3c01469. keywords: {selfheating MoS2 FET NDR effect BN encapsulation heat dissipation}