Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings AITranslate
Abstract AITranslate
Sn-Ag-Cu alloy coating was prepared by using the self-developed Sn-Ag-Cu mesylate electroplating solution on brass substrate.The effects of electroplating process parameters on the composition,surface morphology,and thickness of Sn-Ag-Cu alloy coating were discussed by scanning electron microscope(SEM)and energy dispersive spectroscope(EDS).The results show that under the conditions of a current density of 4 A/dm2,a temperature of 25℃,and a pH of 5.5,the obtained Sn-Ag-Cu alloy coating has fine and dense crystals,smooth and bright surface,and uniform thickness.
KeyWords AITranslate
1夏晓健,万芯瑗,严康骅,陈云翔,韩纪层,洪毅成,林德源.镍钨镀层的制备及其耐磨性和耐蚀性[J].腐蚀与防护,2023,44(8):29-34.
Basic Information:
DOI:
Chinese Library Classification Number:TG153.2[金属学及工艺—热处理]
Citation Information:
Sn-Ag-Cu alloy coating was prepared by using the self-developed Sn-Ag-Cu mesylate electroplating solution on brass substrate.The effects of electroplating process parameters on the composition,surface morphology,and thickness of Sn-Ag-Cu alloy coating were discussed by scanning electron microscope(SEM)and energy dispersive spectroscope(EDS).The results show that under the conditions of a current density of 4 A/dm2,a temperature of 25℃,and a pH of 5.5,the obtained Sn-Ag-Cu alloy coating has fine and dense crystals,smooth and bright surface,and uniform thickness.
quote
| GB/T 7714-2015 | [1] WEN Si-qian, YAN Yan-fu, ZHOU Hui, et al. Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings[J]. Rare Metals and Cemented Carbides, 2024(1): 63-68. |
| MLA | [1] WEN Si-qian, et al., "Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings." Rare Metals and Cemented Carbides, no. 1, 2024, pp. 63-68. |
| APA | [1] WEN Si-qian, YAN Yan-fu, ZHOU Hui, & CHENG Jiang-yang. (2024). Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings. Rare Metals and Cemented Carbides(1), 63-68. |
| IEEE | [1] WEN Si-qian, YAN Yan-fu, ZHOU Hui, and CHENG Jiang-yang, "Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings," Rare Metals and Cemented Carbides, no. 1, pp. 63-68, 2024. keywords: {Sn-Ag-Cu alloy;electroplating parameter;Sn-Ag-Cu mesylate electroplating solution;surface morphology;coating thickness;current density} |
