Integrated color defect detection method for polysilicon wafers using machine vision AITranslate
Abstract AITranslate
For the typical color defects of polysilicon wafers, i.e., edge discoloration, color inaccuracy and color non-uniformity, a new integrated machine vision detection method is proposed based on an HSV color model. By transforming RGB image into three-channel HSV images, the HSV model can efficiently reduce the disturbances of complex wafer textures. A fuzzy color clustering method is used to detect edge discoloration by defining membership function for each channel image. The mean-value classifying method and region growing method are used to identify the other two defects, respectively. A vision detection system is developed and applied in the production of polysilicon wafers.
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Basic Information:
DOI:https://doi.org/10.1007/s40436-014-0095-9
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Citation Information:
For the typical color defects of polysilicon wafers, i.e., edge discoloration, color inaccuracy and color non-uniformity, a new integrated machine vision detection method is proposed based on an HSV color model. By transforming RGB image into three-channel HSV images, the HSV model can efficiently reduce the disturbances of complex wafer textures. A fuzzy color clustering method is used to detect edge discoloration by defining membership function for each channel image. The mean-value classifying method and region growing method are used to identify the other two defects, respectively. A vision detection system is developed and applied in the production of polysilicon wafers.
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| GB/T 7714-2015 | [1] ZaiFang Zhang, Yuan Liu, XiaoSong Wu, et al. Advances in Manufacturing, 2014(2). DOI:10.1007/s40436-014-0095-9. |
| MLA | [1] ZaiFang Zhang, et al., Advances in Manufacturing, no. 2, 2014, https://doi.org/10.1007/s40436-014-0095-9. |
| APA | [1] ZaiFang Zhang, Yuan Liu, XiaoSong Wu, & ShuLin Kan. (2014). Advances in Manufacturing(2). https://doi.org/10.1007/s40436-014-0095-9 |
| IEEE | [1] ZaiFang Zhang, Yuan Liu, XiaoSong Wu, and ShuLin Kan, Advances in Manufacturing, no. 2, 2014, doi: 10.1007/s40436-014-0095-9. keywords: {Polysilicon wafers;Color defect detection;Machine vision;Fuzzy color clustering;Region growing method} |
