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Engineering Strain and Texture in Ferroelectric Scandium-Doped Aluminium Nitride Engineering Strain and Texture in Ferroelectric Scandium-Doped Aluminium Nitride AITranslate

imec, Kapeldreef 75;imec, Kapeldreef 75;imec, Kapeldreef 75;imec, Kapeldreef 75;imec, Kapeldreef 75;imec, Kapeldreef 75;imec, Kapeldreef 75;Taiwan Semiconductor Manufacturing Company (TSMC), Leuven 3001;Taiwan Semiconductor Manufacturing Company (TSMC), Leuven 3001;Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu 300;imec, Kapeldreef 75;imec, Kapeldreef 75;imec, Kapeldreef 75
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Publisher: ACS
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Abstract AITranslate

Materials and interfacial engineering yielded ferroelectricity in Al1–xScxN films of 15 nm thickness for the first time. Bottom electrodes were explored and selected for optimal properties through modification of the strain state and thus the texture in the films. Pt bottom interfaces were shown to be the best for the widest doping window of Sc in the structure and the lowest leakage. Mo bottom interfaces promoted mixed texture in the films, which led to a reduced breakdown E-field and a reduced doping window. Top electrode stacks were shown to modify strain state and effect leakage, enabling full interfacial engineering of this material. Here, Mo top electrode interfaces caused a reduction of the coercive electric field, thus allowing strain engineering of this material and opening the door to application in memory devices.

KeyWords AITranslate

ferroelectric Al1−xScxN thin film texture strain
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Basic Information:

DOI:https://doi.org/10.1021/acsaelm.2c01421

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Citation Information:

Materials and interfacial engineering yielded ferroelectricity in Al1–xScxN films of 15 nm thickness for the first time. Bottom electrodes were explored and selected for optimal properties through modification of the strain state and thus the texture in the films. Pt bottom interfaces were shown to be the best for the widest doping window of Sc in the structure and the lowest leakage. Mo bottom interfaces promoted mixed texture in the films, which led to a reduced breakdown E-field and a reduced doping window. Top electrode stacks were shown to modify strain state and effect leakage, enabling full interfacial engineering of this material. Here, Mo top electrode interfaces caused a reduction of the coercive electric field, thus allowing strain engineering of this material and opening the door to application in memory devices.

quote

GB/T 7714-2015 [1] Sean R. C. McMitchell, Amey M. Walke, Kaustuv Banerjee, et al. ACS Applied Electronic Materials, 2023(5). DOI:10.1021/acsaelm.2c01421.
MLA [1] Sean R. C. McMitchell, et al., ACS Applied Electronic Materials, no. 5, 2023, https://doi.org/10.1021/acsaelm.2c01421.
APA [1] Sean R. C. McMitchell, Amey M. Walke, Kaustuv Banerjee, Sofie Mertens, Xiaoyu Piao, Ming Mao, Kostantine Katcko, Georgios Vellianitis, Mark Van Dal, YuMing Lin, Geert Van den Bosch, Romain Delhougne, & Gouri S. Kar. (2023). ACS Applied Electronic Materials(5). https://doi.org/10.1021/acsaelm.2c01421
IEEE [1] Sean R. C. McMitchell, Amey M. Walke, Kaustuv Banerjee, Sofie Mertens, Xiaoyu Piao, Ming Mao, Kostantine Katcko, Georgios Vellianitis, Mark Van Dal, YuMing Lin, Geert Van den Bosch, Romain Delhougne, and Gouri S. Kar, ACS Applied Electronic Materials, no. 5, 2023, doi: 10.1021/acsaelm.2c01421. keywords: {ferroelectric Al1−xScxN thin film texture strain}