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Numerical Simulation and Technical Study of Superplastic Forming/Diffusion Bonding for Ti Alloy Sheet AITranslate

Nanjing University of Aeronautics and Space University School of Mechanical and Electrical;Nanjing University of Aeronautics and Space University School of Mechanical and Electrical;Nanjing University of Aeronautics and Space University School of Mechanical and Electrical;Nanjing University of Aeronautics and Space University School of Mechanical and Electrical
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Publisher: Editorial Office of Rare Metals and Cemented Carbides
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Abstract AITranslate

The finite element Marc software was used to numerically simulate the processes of superplastie forming/diffusion bonding of TC4,a Ti alloy sheet. Based on the optimized pressure-time (p-t) curve obtained from simulation,the following experiments of superplastic forming/diffusion bonding were carried out. The experimental results show that the optimal technological parameters of TC4 superplastic forming/ diffusion bonding are as follows: superplastic forming θ=900℃,p=2. 5 MPa,t=790 s;diffusion bonding θ=900℃ ,p=3 MPa,t=80 min.

KeyWords AITranslate

Ti alloy TC4 superplastic forming/diffusion bonding (SPF/DB) numerical simulation technical study

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Basic Information:

DOI:

Chinese Library Classification Number:TG146.23[金属学及工艺—金属材料]

Citation Information:

The finite element Marc software was used to numerically simulate the processes of superplastie forming/diffusion bonding of TC4,a Ti alloy sheet. Based on the optimized pressure-time (p-t) curve obtained from simulation,the following experiments of superplastic forming/diffusion bonding were carried out. The experimental results show that the optimal technological parameters of TC4 superplastic forming/ diffusion bonding are as follows: superplastic forming θ=900℃,p=2. 5 MPa,t=790 s;diffusion bonding θ=900℃ ,p=3 MPa,t=80 min.

quote

GB/T 7714-2015 [1] HUANG Gang-hua, ZHANG Yi-hua, MEN Xiang-nan, et al. Numerical Simulation and Technical Study of Superplastic Forming/Diffusion Bonding for Ti Alloy Sheet[J]. Rare Metals and Cemented Carbides, 2009(3): 16-19.
MLA [1] HUANG Gang-hua, et al., "Numerical Simulation and Technical Study of Superplastic Forming/Diffusion Bonding for Ti Alloy Sheet." Rare Metals and Cemented Carbides, no. 3, 2009, pp. 16-19.
APA [1] HUANG Gang-hua, ZHANG Yi-hua, MEN Xiang-nan, & DOU Xiao-li. (2009). Numerical Simulation and Technical Study of Superplastic Forming/Diffusion Bonding for Ti Alloy Sheet. Rare Metals and Cemented Carbides(3), 16-19.
IEEE [1] HUANG Gang-hua, ZHANG Yi-hua, MEN Xiang-nan, and DOU Xiao-li, "Numerical Simulation and Technical Study of Superplastic Forming/Diffusion Bonding for Ti Alloy Sheet," Rare Metals and Cemented Carbides, no. 3, pp. 16-19, 2009. keywords: {Ti alloy TC4;superplastic forming/diffusion bonding (SPF/DB);numerical simulation;technical study}