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High Thermally Stable Anthracene-Based Polyimides with Low Dielectric Constants and Dissipation Factors AITranslate

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Abstract AITranslate

At present, high-performance polymers with low dielectric constants (Dk) and low dissipation factors (Df) have gained much attention with the rapid evolution of microelectronic and 5G communication technologies. Due to their excellent thermal stabilities, heat resistances, mechanical strengths, and dielectric properties, polyimides (PIs) have attracted a lot of attention. Herein, a series of anthracene (An)-based PIs are synthesized from an ester-functionalized anthracene diamine (An-NH2) monomer and four kinds of commercial dianhydrides such as keto (3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA)), sulfone (3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA)), fluoro (4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)), and ether (4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) and 4,4-oxydiphthalic anhydride (ODPA)) functional groups by a two-step process, i.e., the chemical polyaddition followed by thermal imidization. The resulting An-NH2/BTDA, An-NH2/DSDA, An-NH2/6FDA, An-NH2/BPADA, and An-NH2/ODPA PIs are denoted as AnBT-PI, AnDS-PI, An6F-PI, AnBPA-PI, and AnOD-PI, respectively. As a result, all An-based PI films display excellent thermal properties, with thermal decomposition temperatures of 450–530 °C (Td5% weight loss) and glass transition temperatures (Tg) of 270–410 °C. In addition, these PI films exhibit decent optical transparency, flexibility, coefficient of thermal expansion (CTE), and mechanical properties. Remarkably, all An-based PI films show excellent dielectric properties with a low Dk of 2.540–3.388 and a Df of 0.0059–0.0240 at high frequency (10 GHz). In particular, the An-based PI films with ether linkages (AnOD-PI and AnBPA-PI) and a high fluorine content (An6F-PI) show low Dk and Df values compared with those with keto (AnBT-PI) and sulfone (AnDS-PI) linkages. These results indicate that the An-based PIs are promising candidates for achieving low Dk and Df values at higher frequencies. Overall, we believe this study will provide useful guidelines for the further structural development of An-based PIs with low Dk and Df.

KeyWords AITranslate

anthracene polyimides high thermal stability low dielectric constant low dissipation factor coefficient of thermal expansion
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Basic Information:

DOI:https://doi.org/10.1021/acsapm.3c02003

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Citation Information:

At present, high-performance polymers with low dielectric constants (Dk) and low dissipation factors (Df) have gained much attention with the rapid evolution of microelectronic and 5G communication technologies. Due to their excellent thermal stabilities, heat resistances, mechanical strengths, and dielectric properties, polyimides (PIs) have attracted a lot of attention. Herein, a series of anthracene (An)-based PIs are synthesized from an ester-functionalized anthracene diamine (An-NH2) monomer and four kinds of commercial dianhydrides such as keto (3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA)), sulfone (3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA)), fluoro (4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)), and ether (4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) and 4,4-oxydiphthalic anhydride (ODPA)) functional groups by a two-step process, i.e., the chemical polyaddition followed by thermal imidization. The resulting An-NH2/BTDA, An-NH2/DSDA, An-NH2/6FDA, An-NH2/BPADA, and An-NH2/ODPA PIs are denoted as AnBT-PI, AnDS-PI, An6F-PI, AnBPA-PI, and AnOD-PI, respectively. As a result, all An-based PI films display excellent thermal properties, with thermal decomposition temperatures of 450–530 °C (Td5% weight loss) and glass transition temperatures (Tg) of 270–410 °C. In addition, these PI films exhibit decent optical transparency, flexibility, coefficient of thermal expansion (CTE), and mechanical properties. Remarkably, all An-based PI films show excellent dielectric properties with a low Dk of 2.540–3.388 and a Df of 0.0059–0.0240 at high frequency (10 GHz). In particular, the An-based PI films with ether linkages (AnOD-PI and AnBPA-PI) and a high fluorine content (An6F-PI) show low Dk and Df values compared with those with keto (AnBT-PI) and sulfone (AnDS-PI) linkages. These results indicate that the An-based PIs are promising candidates for achieving low Dk and Df values at higher frequencies. Overall, we believe this study will provide useful guidelines for the further structural development of An-based PIs with low Dk and Df.

quote

GB/T 7714-2015 [1] YuehHsing Lee, JinWei Lin, YuChen Huang, et al. ACS Applied Polymer Materials, 2023(5). DOI:10.1021/acsapm.3c02003.
MLA [1] YuehHsing Lee, et al., ACS Applied Polymer Materials, no. 5, 2023, https://doi.org/10.1021/acsapm.3c02003.
APA [1] YuehHsing Lee, JinWei Lin, YuChen Huang, YungJen Huang, Manohar Reddy Busireddy, JiunTai Chen, & ChainShu Hsu. (2023). ACS Applied Polymer Materials(5). https://doi.org/10.1021/acsapm.3c02003
IEEE [1] YuehHsing Lee, JinWei Lin, YuChen Huang, YungJen Huang, Manohar Reddy Busireddy, JiunTai Chen, and ChainShu Hsu, ACS Applied Polymer Materials, no. 5, 2023, doi: 10.1021/acsapm.3c02003. keywords: {anthracene;polyimides;high thermal stability;low dielectric constant;low dissipation factor;coefficient of thermal expansion}