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Emerging Hydrogen-Bond Design for High-Performance Dynamic Polymeric Materials AITranslate

East China University of Science and Technology; East China University of Science and Technology; East China University of Science and Technology
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Publisher: ACS
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Abstract AITranslate

The hydrogen bond, one of the simplest and most versatile noncovalent interactions, is essential for many dynamic functions in living systems. After long-term fundamental development, H-bond chemistry has been well established, with a large family of molecular moieties with tunable binding affinities available. In the past several years, the growing interest in dynamic polymeric materials has aroused a series of emerging applications of H-bond chemistry in dynamic material design. This Perspective aims at discussing the design principles of H-bond-based dynamic materials by summarizing the state of the art of recently emerged H-bond chemistry and materials. Opportunities and challenges are proposed to provide an overview of this research topic, possible future directions, and potential material applications.

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DOI:https://doi.org/10.1021/acsmaterialslett.2c00865

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Citation Information:

The hydrogen bond, one of the simplest and most versatile noncovalent interactions, is essential for many dynamic functions in living systems. After long-term fundamental development, H-bond chemistry has been well established, with a large family of molecular moieties with tunable binding affinities available. In the past several years, the growing interest in dynamic polymeric materials has aroused a series of emerging applications of H-bond chemistry in dynamic material design. This Perspective aims at discussing the design principles of H-bond-based dynamic materials by summarizing the state of the art of recently emerged H-bond chemistry and materials. Opportunities and challenges are proposed to provide an overview of this research topic, possible future directions, and potential material applications.

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GB/T 7714-2015 [1] Yuanxin Deng, Qi Zhang, DaHui Qu. ACS Materials Letters, 2023(5). DOI:10.1021/acsmaterialslett.2c00865.
MLA [1] Yuanxin Deng, et al., ACS Materials Letters, no. 5, 2023, https://doi.org/10.1021/acsmaterialslett.2c00865.
APA [1] Yuanxin Deng, Qi Zhang, & DaHui Qu. (2023). ACS Materials Letters(5). https://doi.org/10.1021/acsmaterialslett.2c00865
IEEE [1] Yuanxin Deng, Qi Zhang, and DaHui Qu, ACS Materials Letters, no. 5, 2023, doi: 10.1021/acsmaterialslett.2c00865.