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Investigation on Densification Mechanism of Copper Infiltrated Tungsten Composites AITranslate

School of Chemistry and Materials Science,Gui Zhou Education University;School of Chemistry and Materials Science,Gui Zhou Education University;School of Chemistry and Materials Science,Gui Zhou Education University;School of Chemistry and Materials Science,Gui Zhou Education University
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Publisher: Editorial Office of Rare Metals and Cemented Carbides
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Abstract AITranslate

Using coarse and fine tungsten powder and copper wire as raw materials,tungsten skeletons were prepared by powder metallurgy,and then copper infiltrated tungsten composites with low copper content(mass fraction lower than 10%) were produced by copper liquid infiltration.The density and microstructure of the composites were analyzed by electronic balance,metallographic microscope and scanning electron microscope,and the densification mechanism of the composites in the infiltration process was discussed.The results show that both capillary force and grain boundary diffusion are the driving force in the infiltration process of tungsten infiltrated copper composites,and the infiltration path can be explained by root system model.Adding inducible metals such as Ni to the tungsten skeleton can strengthen the infiltration process.To prepare dense copper infiltrated tungsten composites with low copper content,tungsten skeletons with high density and interconnected grain boundaries or pores are required.

KeyWords AITranslate

copper infiltrated tungsten composite infiltration tungsten skeleton low copper content densification root system model

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Basic Information:

DOI:

Chinese Library Classification Number:TG146.411[金属学及工艺—金属材料]

Citation Information:

Using coarse and fine tungsten powder and copper wire as raw materials,tungsten skeletons were prepared by powder metallurgy,and then copper infiltrated tungsten composites with low copper content(mass fraction lower than 10%) were produced by copper liquid infiltration.The density and microstructure of the composites were analyzed by electronic balance,metallographic microscope and scanning electron microscope,and the densification mechanism of the composites in the infiltration process was discussed.The results show that both capillary force and grain boundary diffusion are the driving force in the infiltration process of tungsten infiltrated copper composites,and the infiltration path can be explained by root system model.Adding inducible metals such as Ni to the tungsten skeleton can strengthen the infiltration process.To prepare dense copper infiltrated tungsten composites with low copper content,tungsten skeletons with high density and interconnected grain boundaries or pores are required.

quote

GB/T 7714-2015 [1] REN Jun-peng, WANG Yu, ZHAO Jun, et al. Investigation on Densification Mechanism of Copper Infiltrated Tungsten Composites[J]. Rare Metals and Cemented Carbides, 2020(4): 17-23.
MLA [1] REN Jun-peng, et al., "Investigation on Densification Mechanism of Copper Infiltrated Tungsten Composites." Rare Metals and Cemented Carbides, no. 4, 2020, pp. 17-23.
APA [1] REN Jun-peng, WANG Yu, ZHAO Jun, & DONG Cui-ge. (2020). Investigation on Densification Mechanism of Copper Infiltrated Tungsten Composites. Rare Metals and Cemented Carbides(4), 17-23.
IEEE [1] REN Jun-peng, WANG Yu, ZHAO Jun, and DONG Cui-ge, "Investigation on Densification Mechanism of Copper Infiltrated Tungsten Composites," Rare Metals and Cemented Carbides, no. 4, pp. 17-23, 2020. keywords: {copper infiltrated tungsten composite;infiltration;tungsten skeleton;low copper content;densification;root system model}