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Study on Effect Law of Magnetron Sputtering Process Parameters on Microstructure and Properties of TiAlN Films AITranslate

Institute of Metallurgy Engineering,Northeastern University;Institute of Metallurgy Engineering,Northeastern University;Institute of Metallurgy Engineering,Northeastern University;Institute of Metallurgy Engineering,Northeastern University;Institute of Metallurgy Engineering,Northeastern University;Institute of Metallurgy Engineering,Northeastern University
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Publisher: Editorial Office of Rare Metals and Cemented Carbides
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Abstract AITranslate

The effect law of magnetron sputtering process parameters on phase,microstructure,mechanical properties,and adhesion of TiAlN films were analyzed by XRD,SEM,nanoindenter,and nano-scratch tester.The results show that the generated phases of all samples are face-centered cubic TiAlN and preferentially grow on(111)crystal plane.The close-packed triangular pyramid-like grains are formed on the surface of the films.By selecting hardness and adhesion to evaluate the TiAlN films,it is found that the optimal process parameters of hardness and adhesion are substrate bias voltage of-100 V,working air pressure of 0.3 Pa,sputtering current of 8 A,and nitrogen flow of 40 sccm through orthogonal experiments.

KeyWords AITranslate

TiAlN film magnetron sputtering process parameter orthogonal experiment hardness adhesion

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Basic Information:

DOI:

Chinese Library Classification Number:TG174.4[金属学及工艺—金属表面处理]

Citation Information:

The effect law of magnetron sputtering process parameters on phase,microstructure,mechanical properties,and adhesion of TiAlN films were analyzed by XRD,SEM,nanoindenter,and nano-scratch tester.The results show that the generated phases of all samples are face-centered cubic TiAlN and preferentially grow on(111)crystal plane.The close-packed triangular pyramid-like grains are formed on the surface of the films.By selecting hardness and adhesion to evaluate the TiAlN films,it is found that the optimal process parameters of hardness and adhesion are substrate bias voltage of-100 V,working air pressure of 0.3 Pa,sputtering current of 8 A,and nitrogen flow of 40 sccm through orthogonal experiments.

quote

GB/T 7714-2015 [1] LI Chang-heng, LIU Kui-ren, WEI Shi-cheng, et al. Study on Effect Law of Magnetron Sputtering Process Parameters on Microstructure and Properties of TiAlN Films[J]. Rare Metals and Cemented Carbides, 2023(1): 70-76.
MLA [1] LI Chang-heng, et al., "Study on Effect Law of Magnetron Sputtering Process Parameters on Microstructure and Properties of TiAlN Films." Rare Metals and Cemented Carbides, no. 1, 2023, pp. 70-76.
APA [1] LI Chang-heng, LIU Kui-ren, WEI Shi-cheng, HAN Qing, WANG Bo, & WANG Yu-jiang. (2023). Study on Effect Law of Magnetron Sputtering Process Parameters on Microstructure and Properties of TiAlN Films. Rare Metals and Cemented Carbides(1), 70-76.
IEEE [1] LI Chang-heng, LIU Kui-ren, WEI Shi-cheng, HAN Qing, WANG Bo, and WANG Yu-jiang, "Study on Effect Law of Magnetron Sputtering Process Parameters on Microstructure and Properties of TiAlN Films," Rare Metals and Cemented Carbides, no. 1, pp. 70-76, 2023. keywords: {TiAlN film;magnetron sputtering;process parameter;orthogonal experiment;hardness;adhesion}