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Printing Nanostructured Copper for Electromagnetic Interference Shielding Printing Nanostructured Copper for Electromagnetic Interference Shielding AITranslate

The State University of New York;Army Research Laboratory; The State University of New York
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Publisher: ACS
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Abstract AITranslate

Printing metallic nanomaterials toward electromagnetic interference shielding is highly desirable, especially with a minimal thickness and mechanical flexibility. Here, we report the geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding. The electromagnetic interference shielding is observed to increase as the conductivity increases with the optimum electromagnetic interference shielding effectiveness of 65 dB, on which a shielding effectiveness diagram is constructed to illustrate the role of electric conductivity and architectures of printed nanostructured copper features. The findings reported here provide insight into printed flexible metallic materials for electromagnetic interference shielding.

KeyWords AITranslate

copper nanoplates copper nanowires copper nanoparticles electromagnetic interference shielding electrical conductivity
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Basic Information:

DOI:https://doi.org/10.1021/acsaelm.2c00199

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Citation Information:

Printing metallic nanomaterials toward electromagnetic interference shielding is highly desirable, especially with a minimal thickness and mechanical flexibility. Here, we report the geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding. The electromagnetic interference shielding is observed to increase as the conductivity increases with the optimum electromagnetic interference shielding effectiveness of 65 dB, on which a shielding effectiveness diagram is constructed to illustrate the role of electric conductivity and architectures of printed nanostructured copper features. The findings reported here provide insight into printed flexible metallic materials for electromagnetic interference shielding.

quote

GB/T 7714-2015 [1] Aaron Sheng, Jian Yu, Shenqiang Ren. ACS Applied Electronic Materials, 2022(4). DOI:10.1021/acsaelm.2c00199.
MLA [1] Aaron Sheng, et al., ACS Applied Electronic Materials, no. 4, 2022, https://doi.org/10.1021/acsaelm.2c00199.
APA [1] Aaron Sheng, Jian Yu, & Shenqiang Ren. (2022). ACS Applied Electronic Materials(4). https://doi.org/10.1021/acsaelm.2c00199
IEEE [1] Aaron Sheng, Jian Yu, and Shenqiang Ren, ACS Applied Electronic Materials, no. 4, 2022, doi: 10.1021/acsaelm.2c00199. keywords: {copper nanoplates copper nanowires copper nanoparticles electromagnetic interference shielding electrical conductivity}