Printing Nanostructured Copper for Electromagnetic Interference Shielding Printing Nanostructured Copper for Electromagnetic Interference Shielding AITranslate
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Printing metallic nanomaterials toward electromagnetic interference shielding is highly desirable, especially with a minimal thickness and mechanical flexibility. Here, we report the geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding. The electromagnetic interference shielding is observed to increase as the conductivity increases with the optimum electromagnetic interference shielding effectiveness of 65 dB, on which a shielding effectiveness diagram is constructed to illustrate the role of electric conductivity and architectures of printed nanostructured copper features. The findings reported here provide insight into printed flexible metallic materials for electromagnetic interference shielding.
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DOI:https://doi.org/10.1021/acsaelm.2c00199
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Printing metallic nanomaterials toward electromagnetic interference shielding is highly desirable, especially with a minimal thickness and mechanical flexibility. Here, we report the geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding. The electromagnetic interference shielding is observed to increase as the conductivity increases with the optimum electromagnetic interference shielding effectiveness of 65 dB, on which a shielding effectiveness diagram is constructed to illustrate the role of electric conductivity and architectures of printed nanostructured copper features. The findings reported here provide insight into printed flexible metallic materials for electromagnetic interference shielding.
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| GB/T 7714-2015 | [1] Aaron Sheng, Jian Yu, Shenqiang Ren. ACS Applied Electronic Materials, 2022(4). DOI:10.1021/acsaelm.2c00199. |
| MLA | [1] Aaron Sheng, et al., ACS Applied Electronic Materials, no. 4, 2022, https://doi.org/10.1021/acsaelm.2c00199. |
| APA | [1] Aaron Sheng, Jian Yu, & Shenqiang Ren. (2022). ACS Applied Electronic Materials(4). https://doi.org/10.1021/acsaelm.2c00199 |
| IEEE | [1] Aaron Sheng, Jian Yu, and Shenqiang Ren, ACS Applied Electronic Materials, no. 4, 2022, doi: 10.1021/acsaelm.2c00199. keywords: {copper nanoplates copper nanowires copper nanoparticles electromagnetic interference shielding electrical conductivity} |
