Low-Temperature Self-Stacking Ink for Electrohydrodynamic Direct Writing AITranslate

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DOI：https://doi.org/10.1021/acsapm.3c00723

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Flexible electronics have gained significant attention in various fields due to their widespread applications in production and daily life. The electrohydrodynamic direct writing (EDW) is a promising method for fabricating flexible electronics due to its high efficiency, low cost, and ability to produce high-resolution patterns. However, traditional metal-based inks used in the EDW often suffer from agglomeration and needle blockage, which negatively impacts the direct writing effect, especially on flexible substrates. To address these issues, this study proposes a particle-free ink formulation that is simple to prepare and exhibits excellent performance. Polyethylene oxide is a long-chain polymer, and its aqueous solution is a non-Newtonian fluid, which is often used as a thickener and complexing agent for inks. The ink is prepared using a one-pot method based on the silver-amine complexation mechanism, which enables low-temperature sintering without metal particle agglomeration. The fibers fabricated from the ink exhibit a remarkable sintering performance, achieving a resistance of 3.00 kΩ/cm at low temperature of 50 °C. Additionally, the ink produces fibers with self-stacking properties that can be utilized to control the resistance of the fiber. Overall, this ink formulation has significant potential for the preparation of flexible electronics.