Research Progress of Electrocontact Materials for Gold-Based Alloys AITranslate

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Basic Information:

DOI：10.13373/j.cnki.cjrm.XY24010015

Chinese Library Classification Number:TG146.3

Citation Information:

Gold-based alloys have good chemical stability，outstanding electrical contact characteristics，and excellent electrical conductivity. It has become an important material in the field of electronic equipment. The alloy's low yield point and low elastic modulus allow it to perform well under low contact pressure and low current conditions，which is critical in modern precision electronics. What's more，gold-based alloys also have the ability to prevent the formation of oxidized，vulcanized，or organic films with high contact resistance，which typically results in high contact resistance and affects the performance of the device. Therefore，these characteristics make gold-based alloys ideal for manufacturing high-precision electronic components. However，in the ever-evolving field of science and technology and industry，the performance requirements for electrical contact materials are also increasing. There are also some problems in the traditional reinforcement methods. For example，the strength of the material can be enhanced through grain refinement，but this method reduces the grain size and increases the grain boundary area，which hinders the movement of electrons and leads to a significant decrease in electrical conductivity. In addition，although solid solution strengthening can improve material strength by creating a nailing and bypassing mechanism，it causes electrons to scatter when they encounter solute particles during transport，thereby affecting electrical conductivity. Similarly，while work hardening can enhance the strength of the alloy by creating a large number of dislocations，the increased dislocation density can also impede the flow of electrons，thereby reducing electrical conductivity. Therefore，developing a new method that can simultaneously improve the strength and conductivity of gold-based alloys is an important challenge in the current field of materials science. The current research shows that there are two main methods to ensure the high strength and high conductivity of the alloy. The first method is to increase the precipitated phase in the alloy by secondary aging treatment，while reducing the solute content. Because the solute atoms will prevent the normal movement of electrons，resulting in the scattering of electrons during the transport process，the electrical conductivity of the alloy will linearly decrease with the increase of the solute content. By increasing the precipitated phase，the solute content inside the alloy can be effectively reduced，thus reducing the probability of electron scattering. In addition，the second phase particles precipitated by the mechanism of pinning the dislocation can effectively hinder the movement of the dislocation，thereby improving the mechanical strength of the alloy while maintaining or only slightly reducing its electrical conductivity. The second method is to use large plastic deformation to promote the formation of twins. During this treatment，the alloy will form twins in its crystal structure when subjected to greater stress. These twin boundaries，like ordinary grain boundaries，can prevent dislocation movement，thereby improving the mechanical strength of the alloy. In addition，the grain boundary between the two grains in the twin structure has a higher density and smaller grain boundary energy. A lower grain boundary energy means that the atoms in the grain boundary region are arranged more loosely，which helps the electrons encounter fewer obstacles in passing through these grain boundaries. Therefore，promoting the formation of twins by large plastic deformation can not only improve the strength of the alloy，but also maintain or even enhance its conductive properties. In order to solve the problem that the strength of gold-based alloy increases and the conductivity decreases greatly，two methods were proposed based on literature reviews and related theoretical research. Method one adopts the method of secondary aging+cold deformation. In this method，the secondary aging treatment is carried out first，which not only promotes the precipitated phase particles formed after the primary aging treatment to aggregate and grow，but also precipitates new fine second phase. This treatment increases the size of the precipitated phase and precipitated phase particles in the gold-based alloy，thereby reducing the internal solute atoms，which is conducive to improving the strength of the material. Subsequently，through cold deformation treatment，the softening phenomenon caused by secondary aging can be eliminated. Cold deformation not only further enhances the strength of the material，but also helps to maintain the electrical conductivity of the alloy because the dislocation causes a small increase in resistance. Method two adopts the method of low-temperature plastic deformation. This method takes advantage of the characteristics of plastic deformation at low temperature，that is，the atomic migration rate decreases in the low temperature environment，which makes the crystal slip process more difficult，so that twinning becomes the main deformation mechanism，so as to promoting the formation of twins in gold-based alloys. The twin boundary can effectively hinder the movement of the dislocation，thus significantly increasing the strength of the material. At the same time，because the formation of twins usually does not seriously hinder the transmission of electrons，it can maintain the good electrical conductivity of the alloy to a certain extent.