Enhanced Thermal Conductivity of All-Organic Aramid Nanofiber Films via Interfacial Coupling Reaction AITranslate
Abstract AITranslate
It is still a great challenge to prepare intrinsically all-organic thermal conductive membrane with high in-plane and through-plane thermal conductivity. Herein, we designed an all-organic aramid nanofiber thin film with in-plane and through-plane thermal conductivity as high as 15.7 and 0.26 W/mK, respectively, through one step fluorination utilizing F2/N2. We proved that direct fluorination could induce the coupling reaction of benzene rings in neighboring aramid macromolecules to form numerous covalent cross-linking bonds among aramid nanofibers. Benefiting from the cross-linking behavior, interfacial thermal resistance between the nanofibers was suppressed to some extent, thereby leading to enhancement of in-plane and through-plane thermal conductivity by 78.8% and 271.7%, respectively, compared with the unmodified membranes. In addition, the thin films also possess high mechanical strength and electrical insulation, which promote its application potential in flexible electronic fields.
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DOI:https://doi.org/10.1021/acsapm.2c01007
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It is still a great challenge to prepare intrinsically all-organic thermal conductive membrane with high in-plane and through-plane thermal conductivity. Herein, we designed an all-organic aramid nanofiber thin film with in-plane and through-plane thermal conductivity as high as 15.7 and 0.26 W/mK, respectively, through one step fluorination utilizing F2/N2. We proved that direct fluorination could induce the coupling reaction of benzene rings in neighboring aramid macromolecules to form numerous covalent cross-linking bonds among aramid nanofibers. Benefiting from the cross-linking behavior, interfacial thermal resistance between the nanofibers was suppressed to some extent, thereby leading to enhancement of in-plane and through-plane thermal conductivity by 78.8% and 271.7%, respectively, compared with the unmodified membranes. In addition, the thin films also possess high mechanical strength and electrical insulation, which promote its application potential in flexible electronic fields.
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| GB/T 7714-2015 | [1] Boya Liu, Yang Liu, Xiangyang Liu. ACS Applied Polymer Materials, 2022(4). DOI:10.1021/acsapm.2c01007. |
| MLA | [1] Boya Liu, et al., ACS Applied Polymer Materials, no. 4, 2022, https://doi.org/10.1021/acsapm.2c01007. |
| APA | [1] Boya Liu, Yang Liu, & Xiangyang Liu. (2022). ACS Applied Polymer Materials(4). https://doi.org/10.1021/acsapm.2c01007 |
| IEEE | [1] Boya Liu, Yang Liu, and Xiangyang Liu, ACS Applied Polymer Materials, no. 4, 2022, doi: 10.1021/acsapm.2c01007. keywords: {aramid nanofibers;thermal conductivity;direct fluorination;crosslinking;interfacial design} |
