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Enhanced Thermal Conductivity of All-Organic Aramid Nanofiber Films via Interfacial Coupling Reaction AITranslate

Sichuan University; Sichuan University; Sichuan University
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Publisher: ACS
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Abstract AITranslate

It is still a great challenge to prepare intrinsically all-organic thermal conductive membrane with high in-plane and through-plane thermal conductivity. Herein, we designed an all-organic aramid nanofiber thin film with in-plane and through-plane thermal conductivity as high as 15.7 and 0.26 W/mK, respectively, through one step fluorination utilizing F2/N2. We proved that direct fluorination could induce the coupling reaction of benzene rings in neighboring aramid macromolecules to form numerous covalent cross-linking bonds among aramid nanofibers. Benefiting from the cross-linking behavior, interfacial thermal resistance between the nanofibers was suppressed to some extent, thereby leading to enhancement of in-plane and through-plane thermal conductivity by 78.8% and 271.7%, respectively, compared with the unmodified membranes. In addition, the thin films also possess high mechanical strength and electrical insulation, which promote its application potential in flexible electronic fields.

KeyWords AITranslate

aramid nanofibers thermal conductivity direct fluorination crosslinking interfacial design
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Basic Information:

DOI:https://doi.org/10.1021/acsapm.2c01007

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Citation Information:

It is still a great challenge to prepare intrinsically all-organic thermal conductive membrane with high in-plane and through-plane thermal conductivity. Herein, we designed an all-organic aramid nanofiber thin film with in-plane and through-plane thermal conductivity as high as 15.7 and 0.26 W/mK, respectively, through one step fluorination utilizing F2/N2. We proved that direct fluorination could induce the coupling reaction of benzene rings in neighboring aramid macromolecules to form numerous covalent cross-linking bonds among aramid nanofibers. Benefiting from the cross-linking behavior, interfacial thermal resistance between the nanofibers was suppressed to some extent, thereby leading to enhancement of in-plane and through-plane thermal conductivity by 78.8% and 271.7%, respectively, compared with the unmodified membranes. In addition, the thin films also possess high mechanical strength and electrical insulation, which promote its application potential in flexible electronic fields.

quote

GB/T 7714-2015 [1] Boya Liu, Yang Liu, Xiangyang Liu. ACS Applied Polymer Materials, 2022(4). DOI:10.1021/acsapm.2c01007.
MLA [1] Boya Liu, et al., ACS Applied Polymer Materials, no. 4, 2022, https://doi.org/10.1021/acsapm.2c01007.
APA [1] Boya Liu, Yang Liu, & Xiangyang Liu. (2022). ACS Applied Polymer Materials(4). https://doi.org/10.1021/acsapm.2c01007
IEEE [1] Boya Liu, Yang Liu, and Xiangyang Liu, ACS Applied Polymer Materials, no. 4, 2022, doi: 10.1021/acsapm.2c01007. keywords: {aramid nanofibers;thermal conductivity;direct fluorination;crosslinking;interfacial design}