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Printable Ceramic fiber paper has excellentf flexibility at 1200˚C
In flexible electronic devices, the temperature resistance of the device is directly determined by the temperature resistance of the substrate material. There is an urgent need for high-temperature-resistant flexible substrates for the use of flexible electronic devices at high temperatures. Ceramic fiber possesses both flexibility and high temperature resistance, making it a crucial breakthrough in overcoming the current temperature limitations of flexible circuit substrate materials and enhancing the usability of flexible electronic devices under extreme conditions. However, traditional ceramic fiber paper fails to meet the strength requirements of high-temperature circuit substrates due to limitations in its preparation methods. In this work, we successfully addressed this issue by employing electrospinning one-time molding technology, resulting in high-performance ceramic fiber paper that can be directly printed using ordinary inkjet printers even at 1200 °C. Based on its printability and high-temperature resistance, we constructed a simple circuit and validated its potential application as a substrate for high-temperatureresistant flexible electronic devices.
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