A novel crack-free Ti-modified Al-Cu-Mg alloy designed for selective laser melting AITranslate

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DOI：https://doi.org/10.1016/j.addma.2020.101829

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A novel crack-free Ti-modified Al-Cu-Mg alloy for SLM was developed here, based on the thermodynamic calculations of the crack susceptibility index and growth-restriction factor. We found that the introduction of Ti into the Al-Cu-Mg alloy effectively promoted the grain refinement and columnar-to-equiaxed grain transition as a result of the heterogeneous nucleation provided by Al3Ti precipitates. The hot tearing cracks were eliminated after Ti modification due to the formation of the homogeneous and fine equiaxed microstructure. We created a new high-strength Al-Cu-Mg-Ti alloy with a tensile strength of 426.4 MPa, yield strength of 293.2 MPa and ductility of 9.1%. This novel Ti-modified Al alloy with fine equiaxed grains and highly-enhanced mechanical properties offers a new compositional space for the printable lightweight material categories specifically for the SLM technique.