daohang fenxiangbox searchbox qikanlogonew daohangnew searchboxnew navrightzone footerzone paper
English
Chinese 简体中文 English English
Home > Journals > ACS Applied Electronic Materials
‹ Previous Article Next Article ›

Graphene-Enhanced Screen-Printed BiFeO3-Based Thermistors Graphene-Enhanced Screen-Printed BiFeO3-Based Thermistors AITranslate

Paul Fourmont; Yin Bai; FrançoisXavier Fortier; Sylvain G. Cloutier
Department of Electrical Engineering, École de Technologie Supérieure;Department of Electrical Engineering, École de Technologie Supérieure;Department of Electrical Engineering, École de Technologie Supérieure;Department of Electrical Engineering, École de Technologie Supérieure
AITranslate
Publisher: ACS
Share Citation Information Add to Favorites

    Scan to share on WeChat or Moments

Use WeChat scan.
Share with WeChat friends or Moments

Abstract AITranslate

In this study, serigraphic-grade BiFeO3-based ink formulations are produced and then mixed with graphene to enhance the performances of screen-printed thermistor devices. The devices are printed atop a standard thermally boosted glass-reinforced epoxy (FR-4) substrate coated with interdigitated gold electrodes. The broader operating temperature range of these thermistors makes them compatible with standard printed circuit board (PCB) manufacturing and operating conditions. Thus, we achieve highly sensitive devices with a temperature coefficient of resistance (TCR) of −0.96%/°C, which is the highest sensitivity reported yet for any graphene-based thermistor operating from 25 to 170 °C. The best-performing devices are loaded with 3.5 wt % graphene. These low-hysteresis and stable thermistors boast a thermal index (β-coefficient) of 864 K. This optimal graphene loading occurs just above the percolation threshold.

KeyWords AITranslate

screenprinted thermistors printed electronics bismuth ferrite powder printed circuit board graphene
No data

Basic Information:

DOI：https://doi.org/10.1021/acsaelm.2c01093

Chinese Library Classification Number:

Citation Information:

In this study, serigraphic-grade BiFeO3-based ink formulations are produced and then mixed with graphene to enhance the performances of screen-printed thermistor devices. The devices are printed atop a standard thermally boosted glass-reinforced epoxy (FR-4) substrate coated with interdigitated gold electrodes. The broader operating temperature range of these thermistors makes them compatible with standard printed circuit board (PCB) manufacturing and operating conditions. Thus, we achieve highly sensitive devices with a temperature coefficient of resistance (TCR) of −0.96%/°C, which is the highest sensitivity reported yet for any graphene-based thermistor operating from 25 to 170 °C. The best-performing devices are loaded with 3.5 wt % graphene. These low-hysteresis and stable thermistors boast a thermal index (β-coefficient) of 864 K. This optimal graphene loading occurs just above the percolation threshold.

quote

GB/T 7714-2015 [1] Paul Fourmont, Yin Bai, FrançoisXavier Fortier, et al. ACS Applied Electronic Materials, 2022(4). DOI:10.1021/acsaelm.2c01093.
MLA [1] Paul Fourmont, et al., ACS Applied Electronic Materials, no. 4, 2022, https://doi.org/10.1021/acsaelm.2c01093.
APA [1] Paul Fourmont, Yin Bai, FrançoisXavier Fortier, & Sylvain G. Cloutier. (2022). ACS Applied Electronic Materials(4). https://doi.org/10.1021/acsaelm.2c01093
IEEE [1] Paul Fourmont, Yin Bai, FrançoisXavier Fortier, and Sylvain G. Cloutier, ACS Applied Electronic Materials, no. 4, 2022, doi: 10.1021/acsaelm.2c01093. keywords: {screenprinted thermistors printed electronics bismuth ferrite powder printed circuit board graphene}