Formation of Thermally Conductive Network Accompanied by Reduction of Interface Resistance for Thermal Conductivity Enhancement of Silicone Rubber Formation of Thermally Conductive Network Accompanied by Reduction of Interface Resistance for Thermal Conductivity Enhancement of Silicone Rubber AITranslate

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DOI：https://doi.org/10.1021/acsaelm.2c00475

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Utilizing the synergetic effects of different-sized fillers to effectively construct a thermally conductive network in polymer-based composites is an important strategy to dissipate the heat produced by electronic equipment. In this work, a remarkable synergetic efficiency is achieved in silicone rubber (SR) composites loaded with boron nitride-polydopamine-silver (BN-PDA-Ag) and carbon nanotube-polydopamine-silver (CNT-PDA-Ag) systems by constructing a hybrid heat conductive network. Specifically, PDA decreases the interface thermal resistance by improving the compatibility between the fillers and the polymeric matrix, while Ag nanoparticles further enhance thermal conductivity (TC). Finally, the TC value for SR composites reaches 0.655 W/mK, 4.17 times that of SR matrix. Additionally, a high dielectric constant and a relatively low electrical conductivity are obtained for SR composites. Overall, this strategy offers a valuable basis to prepare thermal management materials for application in electronic components.