Multibenzocyclobutene Functionalized Silane for Low-k Polyarylsilane Thermosets with Low Coefficient of Thermal Expansion and High Thermostability AITranslate
Abstract AITranslate
Highly cross-linked thermosets have been extensively studied for their good thermostability and low coefficient of thermal expansion (CTE). Herein, multibenzocyclobutene (multi-BCB) functionalized silane monomers and the related thermosets as polyarylsilane are reported. These silane monomers can be cured at a high temperature above 200 °C. After curing, the corresponding transparent thermosets showed good thermal property. The results indicated that more benzocyclobutene (BCB) groups on the corresponding silane monomer induced a higher cross-linked structure, which contributes to improve heat resistance, glass transition temperature (Tg), and dimensional stability. Particularly, the cured tetra(benzocyclobutene-4-yl) silane (SiB4) showed extremely high Tg over 400 °C, high initial storage modulus, and good thermostability (Td5 = 532 °C). The cured SiB4 also showed excellent thermomechanical properties with a low CTE at 24 ppm/°C. These polymers also showed good dielectric properties with a low k below 2.70. The low-k material with a low CTE may be a good candidate for high-performance composite resin matrix and high-density substrates.
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DOI:https://doi.org/10.1021/acsapm.9b00519
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Highly cross-linked thermosets have been extensively studied for their good thermostability and low coefficient of thermal expansion (CTE). Herein, multibenzocyclobutene (multi-BCB) functionalized silane monomers and the related thermosets as polyarylsilane are reported. These silane monomers can be cured at a high temperature above 200 °C. After curing, the corresponding transparent thermosets showed good thermal property. The results indicated that more benzocyclobutene (BCB) groups on the corresponding silane monomer induced a higher cross-linked structure, which contributes to improve heat resistance, glass transition temperature (Tg), and dimensional stability. Particularly, the cured tetra(benzocyclobutene-4-yl) silane (SiB4) showed extremely high Tg over 400 °C, high initial storage modulus, and good thermostability (Td5 = 532 °C). The cured SiB4 also showed excellent thermomechanical properties with a low CTE at 24 ppm/°C. These polymers also showed good dielectric properties with a low k below 2.70. The low-k material with a low CTE may be a good candidate for high-performance composite resin matrix and high-density substrates.
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| GB/T 7714-2015 | [1] Yuanrong Cheng, Jing Cai, Junyi Li, et al. ACS Applied Polymer Materials, 2019(1). DOI:10.1021/acsapm.9b00519. |
| MLA | [1] Yuanrong Cheng, et al., ACS Applied Polymer Materials, no. 1, 2019, https://doi.org/10.1021/acsapm.9b00519. |
| APA | [1] Yuanrong Cheng, Jing Cai, Junyi Li, Xueliang Wu, Yunfei Shi, & Jun Wang. (2019). ACS Applied Polymer Materials(1). https://doi.org/10.1021/acsapm.9b00519 |
| IEEE | [1] Yuanrong Cheng, Jing Cai, Junyi Li, Xueliang Wu, Yunfei Shi, and Jun Wang, ACS Applied Polymer Materials, no. 1, 2019, doi: 10.1021/acsapm.9b00519. keywords: {low coefficient of thermal expansion;highly crosslinked thermosets;lowk;polyarylsilane;thermostability} |
