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Perovskite photodetectors for flexible electronics: Recent advances and perspectives AITranslate

Fujian Normal University; Fujian Normal University; Northwestern Polytechnical University; Northwestern Polytechnical University; Nanjing Tech University (NanjingTech); Nanjing Tech University (NanjingTech)
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Publisher: Elsevier
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Abstract AITranslate

Next-generation optoelectronics with lightweight, low-cost, high flexibility, and large-area compatibility have been developed to conform to soft surfaces, even human skins, to achieve various wearable and portable functionalities. Among them, flexible photodetectors (FPDs) based on metal halide perovskites (MHPs) have become an emerging optoelectronic device due to their tunable optoelectronic properties, excellent light-sensing performance, remarkable mechanical flexibility, and relatively low-temperature solution processability. This review examines the recent advances in FPDs based on MHPs, focusing on both the materials and devices of optoelectronic and mechanical properties, the deposition and patterning technologies, the encapsulation strategies, and their potential applications in conformable electronics. We also discuss the challenges and provide a future perspective on the further applications.

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DOI:https://doi.org/10.1016/j.apmt.2022.101509

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Citation Information:

Next-generation optoelectronics with lightweight, low-cost, high flexibility, and large-area compatibility have been developed to conform to soft surfaces, even human skins, to achieve various wearable and portable functionalities. Among them, flexible photodetectors (FPDs) based on metal halide perovskites (MHPs) have become an emerging optoelectronic device due to their tunable optoelectronic properties, excellent light-sensing performance, remarkable mechanical flexibility, and relatively low-temperature solution processability. This review examines the recent advances in FPDs based on MHPs, focusing on both the materials and devices of optoelectronic and mechanical properties, the deposition and patterning technologies, the encapsulation strategies, and their potential applications in conformable electronics. We also discuss the challenges and provide a future perspective on the further applications.

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GB/T 7714-2015 [1] Yue Wang, Deli Li, Lingfeng Chao, et al. Applied Materials Today, 2022(28). DOI:10.1016/j.apmt.2022.101509.
MLA [1] Yue Wang, et al., Applied Materials Today, no. 28, 2022, https://doi.org/10.1016/j.apmt.2022.101509.
APA [1] Yue Wang, Deli Li, Lingfeng Chao, Tingting Niu, Yonghua Chen, & Wei Huang. (2022). Applied Materials Today(28). https://doi.org/10.1016/j.apmt.2022.101509
IEEE [1] Yue Wang, Deli Li, Lingfeng Chao, Tingting Niu, Yonghua Chen, and Wei Huang, Applied Materials Today, no. 28, 2022, doi: 10.1016/j.apmt.2022.101509.