Advanced Applications of Metal–Organic Decomposition Inks in Printed Electronics Advanced Applications of Metal–Organic Decomposition Inks in Printed Electronics AITranslate
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Technology-based industries are constantly seeking materials and methods to fabricate compact, high-performance, and increasingly more complex printed electronic devices, fostering research in advanced conductive inks and processing techniques. Metal–organic decomposition (MOD) inks are a class of conductive inks based on molecular metal precursors that decompose into metallic features once printed, imparting them with unique attributes that distinguish them from particle-based inks. This Spotlight on Applications summarizes recent progress in understanding the chemistry, rheology, and printability of MOD inks that enable them to be printed, processed, and used with material substrates in unconventional ways. Their unique properties and capabilities are being leveraged to advance the field of printed electronics, from their use in 2.5D and 3D surfaces, wearables, and fine line printing and thus broadening the form factors and improving properties of devices used in the medial, automotive and aerospace industries.
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DOI:https://doi.org/10.1021/acsaelm.3c00910
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Technology-based industries are constantly seeking materials and methods to fabricate compact, high-performance, and increasingly more complex printed electronic devices, fostering research in advanced conductive inks and processing techniques. Metal–organic decomposition (MOD) inks are a class of conductive inks based on molecular metal precursors that decompose into metallic features once printed, imparting them with unique attributes that distinguish them from particle-based inks. This Spotlight on Applications summarizes recent progress in understanding the chemistry, rheology, and printability of MOD inks that enable them to be printed, processed, and used with material substrates in unconventional ways. Their unique properties and capabilities are being leveraged to advance the field of printed electronics, from their use in 2.5D and 3D surfaces, wearables, and fine line printing and thus broadening the form factors and improving properties of devices used in the medial, automotive and aerospace industries.
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| GB/T 7714-2015 | [1] Arnold J. Kell, Kaitlin Wagner, Xiangyang Liu, et al. ACS Applied Electronic Materials, 2024(6). DOI:10.1021/acsaelm.3c00910. |
| MLA | [1] Arnold J. Kell, et al., ACS Applied Electronic Materials, no. 6, 2024, https://doi.org/10.1021/acsaelm.3c00910. |
| APA | [1] Arnold J. Kell, Kaitlin Wagner, Xiangyang Liu, Benoît H. Lessard, & Chantal Paquet. (2024). ACS Applied Electronic Materials(6). https://doi.org/10.1021/acsaelm.3c00910 |
| IEEE | [1] Arnold J. Kell, Kaitlin Wagner, Xiangyang Liu, Benoît H. Lessard, and Chantal Paquet, ACS Applied Electronic Materials, no. 6, 2024, doi: 10.1021/acsaelm.3c00910. keywords: {Printed electronics Additive manufacturing Metal−organic decomposition inks Molecular inks Electronic applicationsShow More} |
