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Molybdenum Thin Film Formation from Molybdenum Nitride Deposited by Plasma-enhanced Atomic Layer Deposition with Hydrogen-permeable Mechanical Capping Layer Molybdenum Thin Film Formation from Molybdenum Nitride Deposited by Plasma-enhanced Atomic Layer Deposition with Hydrogen-permeable Mechanical Capping Layer AITranslate

Kyung Hee University; Kyung Hee University;R&D Team 1, UP Chemical Co., Ltd.;R&D Team 1, UP Chemical Co., Ltd.; Kyung Hee University
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Publisher: ACS
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Abstract AITranslate

In this study, we developed a Mo metal thin film deposition process consisting of two steps: Mo2N thin film deposition using plasma-enhanced atomic layer deposition, followed by rapid thermal annealing. The mechanism underlying the reduction of Mo2N during the post-deposition annealing was investigated. Agglomeration during the reduction of Mo2N to Mo was successfully suppressed by using a hydrogen-permeable mechanical capping layer. Finally, a Mo thin film formation process with low resistance, even at a thickness of 5 nm, was achieved.

KeyWords AITranslate

molybdenum plasmaenhanced atomic layer deposition agglomeration capping layer metal thin film
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Basic Information:

DOI:https://doi.org/10.1021/acsaelm.3c00711

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Citation Information:

In this study, we developed a Mo metal thin film deposition process consisting of two steps: Mo2N thin film deposition using plasma-enhanced atomic layer deposition, followed by rapid thermal annealing. The mechanism underlying the reduction of Mo2N during the post-deposition annealing was investigated. Agglomeration during the reduction of Mo2N to Mo was successfully suppressed by using a hydrogen-permeable mechanical capping layer. Finally, a Mo thin film formation process with low resistance, even at a thickness of 5 nm, was achieved.

quote

GB/T 7714-2015 [1] Jeong Hyeon Park, Ye Won Kim, Myeong Ho Kim, et al. ACS Applied Electronic Materials, 2023(5). DOI:10.1021/acsaelm.3c00711.
MLA [1] Jeong Hyeon Park, et al., ACS Applied Electronic Materials, no. 5, 2023, https://doi.org/10.1021/acsaelm.3c00711.
APA [1] Jeong Hyeon Park, Ye Won Kim, Myeong Ho Kim, JinSik Kim, & Woojin Jeon. (2023). ACS Applied Electronic Materials(5). https://doi.org/10.1021/acsaelm.3c00711
IEEE [1] Jeong Hyeon Park, Ye Won Kim, Myeong Ho Kim, JinSik Kim, and Woojin Jeon, ACS Applied Electronic Materials, no. 5, 2023, doi: 10.1021/acsaelm.3c00711. keywords: {molybdenum plasmaenhanced atomic layer deposition agglomeration capping layer metal thin film}