Wetting in Soldering and Microelectronics AITranslate
Abstract AITranslate
Wettability of solid metals by molten solders is reviewed. The contact angle and wetting force are tabulated for various combinations of solid metals and molten solders such as Sn-Pb base alloys, Sn-Ag base alloys, Sn-Zn base alloys, Sn-Cu base alloys, and Sn-Bi base alloys. Studies on the wetting rate are also discussed.
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DOI：https://doi.org/10.1146/annurev.matsci.38.060407.132448
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Citation Information:
Wettability of solid metals by molten solders is reviewed. The contact angle and wetting force are tabulated for various combinations of solid metals and molten solders such as Sn-Pb base alloys, Sn-Ag base alloys, Sn-Zn base alloys, Sn-Cu base alloys, and Sn-Bi base alloys. Studies on the wetting rate are also discussed.
quote
| GB/T 7714-2015 | [1] T. Matsumoto, K. Nogi. Annual Review of Materials Research, 2008(38). DOI:10.1146/annurev.matsci.38.060407.132448. |
| MLA | [1] T. Matsumoto, and K. Nogi. Annual Review of Materials Research, no. 38, 2008, https://doi.org/10.1146/annurev.matsci.38.060407.132448. |
| APA | [1] T. Matsumoto, & K. Nogi. (2008). Annual Review of Materials Research(38). https://doi.org/10.1146/annurev.matsci.38.060407.132448 |
| IEEE | [1] T. Matsumoto and K. Nogi, Annual Review of Materials Research, no. 38, 2008, doi: 10.1146/annurev.matsci.38.060407.132448. keywords: {wetting force;contact angle;sessile drop method;wetting balance method} |