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High Thermal Conductivity Semicrystalline Epoxy Resins with Anthraquinone-Based Hardeners AITranslate

Guangxin Lv; Elynn Jensen; Christopher M. Evans; David G. Cahill
University of Illinois at Urbana−Champaign; University of Illinois at Urbana−Champaign; University of Illinois at Urbana−Champaign; University of Illinois at Urbana−Champaign
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Publisher: ACS
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Abstract AITranslate

Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (∼0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is ∼2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

KeyWords AITranslate

epoxy resin thermal conductivity molecular structure semicrystal crystallinity minimum thermal conductivity model
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Basic Information:

DOI：https://doi.org/10.1021/acsapm.1c00737

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Citation Information:

Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (∼0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is ∼2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

quote

GB/T 7714-2015 [1] Guangxin Lv, Elynn Jensen, Christopher M. Evans, et al. ACS Applied Polymer Materials, 2021(3). DOI:10.1021/acsapm.1c00737.
MLA [1] Guangxin Lv, et al., ACS Applied Polymer Materials, no. 3, 2021, https://doi.org/10.1021/acsapm.1c00737.
APA [1] Guangxin Lv, Elynn Jensen, Christopher M. Evans, & David G. Cahill. (2021). ACS Applied Polymer Materials(3). https://doi.org/10.1021/acsapm.1c00737
IEEE [1] Guangxin Lv, Elynn Jensen, Christopher M. Evans, and David G. Cahill, ACS Applied Polymer Materials, no. 3, 2021, doi: 10.1021/acsapm.1c00737. keywords: {epoxy resin;thermal conductivity;molecular structure;semicrystal;crystallinity;minimum thermal conductivity model}