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Self-Curing Phthalonitrile Resin with Disulfide Bond as the Curing Group AITranslate

Sichuan University; Sichuan University; Sichuan University; Sichuan University; Sichuan University; Sichuan University
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Publisher: ACS
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Abstract AITranslate

To further investigate the presence of a radical mechanism in the curing process of phthalonitrile resins, a conventional radical initiation unit (disulfide segment) was introduced into phthalonitrile resins for the first time. A disulfide-bond-containing phthalonitrile monomer (DPBPN) was successfully synthesized. Its self-curing reaction could be promoted by disulfide segments in the precursor. Rheological measurements and differential scanning calorimetry showed that DPBPN exhibited a low melting point (124.5 °C) and a wide processing window (120 °C). Infrared spectroscopy confirmed the formation of isoindoline, triazine, and phthalocyanine structures in the product. Thermal gravimetric analysis and dynamic mechanical analysis suggested the outstanding thermal stability and high glass transition temperature (Tg) of the cured resin with a moderate curing process.

KeyWords AITranslate

phthalonitrile resin disulfide bond curing behavior curing mechanisms thermal and thermomechanical properties
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Basic Information:

DOI:https://doi.org/10.1021/acsapm.3c01485

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Citation Information:

To further investigate the presence of a radical mechanism in the curing process of phthalonitrile resins, a conventional radical initiation unit (disulfide segment) was introduced into phthalonitrile resins for the first time. A disulfide-bond-containing phthalonitrile monomer (DPBPN) was successfully synthesized. Its self-curing reaction could be promoted by disulfide segments in the precursor. Rheological measurements and differential scanning calorimetry showed that DPBPN exhibited a low melting point (124.5 °C) and a wide processing window (120 °C). Infrared spectroscopy confirmed the formation of isoindoline, triazine, and phthalocyanine structures in the product. Thermal gravimetric analysis and dynamic mechanical analysis suggested the outstanding thermal stability and high glass transition temperature (Tg) of the cured resin with a moderate curing process.

quote

GB/T 7714-2015 [1] Jianghuai Hu, Yu Pu, Rongtao Zhou, et al. ACS Applied Polymer Materials, 2023(5). DOI:10.1021/acsapm.3c01485.
MLA [1] Jianghuai Hu, et al., ACS Applied Polymer Materials, no. 5, 2023, https://doi.org/10.1021/acsapm.3c01485.
APA [1] Jianghuai Hu, Yu Pu, Rongtao Zhou, Xian He, Ke Zeng, & Gang Yang. (2023). ACS Applied Polymer Materials(5). https://doi.org/10.1021/acsapm.3c01485
IEEE [1] Jianghuai Hu, Yu Pu, Rongtao Zhou, Xian He, Ke Zeng, and Gang Yang, ACS Applied Polymer Materials, no. 5, 2023, doi: 10.1021/acsapm.3c01485. keywords: {phthalonitrile resin;disulfide bond;curing behavior;curing mechanisms;thermal and thermomechanical properties}