Study on the Preparation of WC Reinforced W-25Cu Composites Assisted by Phenolic Resin and Their Microstructure and Properties AITranslate

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Chinese Library Classification Number:TB331[一般工业技术—材料科学与工程]

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W-Cu composites have important applications in the fields of electronic packaging,nuclear energy industry and military aerospace due to the combination of tungsten's high hardness and high temperature resistance with copper's excellent thermal conductivity and electrical conductivity.However,the poor mutual solubility and wettability between W and Cu phases limit further comprehensive performance improvement of the material.In this paper,W-25Cu composites were prepared by a scalable pressureless infiltration process.Submicron WC phases were formed at the W/Cu interfaces by in-situ reaction using the high carbon residue characteristics of phenolic resin,and the microstructure and properties of WC reinforced W-25Cu composites were investigated.The results show that compared with low carbon residue binders such as stearic acid,paraffin and rubber solution,the addition of phenolic resin significantly enhances the relative density and hardness of W-25Cu composite,though it slightly reduces electrical conductivity.To a certain extent,increasing the infiltration temperature and prolonging the holding time can improve the properties of the material,but excessive temperature causes copper leakage on the surface of the material and impairs its performance.The comprehensive performance of W-25Cu composite is the best under the pressureless infiltration process of 1300℃ for 120 min,and the relative density,hardness and electrical conductivity reach 99%,243 HV and 46.7%IACS,respectively.