Hydrogen-Bonding Interaction-Driven Catechin Assembly into Solvent-Free Supramolecular Adhesive with Antidrying and Antifreezing Properties AITranslate

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DOI：https://doi.org/10.1021/acsapm.2c00280

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Solvent-free adhesive materials are attracting intensive attention compared to synthetic adhesives in both organic and aqueous solutions on account of their stability and processability. Herein, we developed a type of solvent-free supramolecular adhesive driven by hydrogen-bonding interaction, facilely formed by heating the mixture of catechin (CA) and poly(ethylene glycol) (PEG). The resulted bulk solvent-free adhesive showcased strong adhesion to diverse substrates, enhanced shear strength under vacuum (−80 °C, <1 Pa) and at low temperatures (−196 °C), swelling resistance to organic solvents, and excellent bioactivity. This work manifests that the bulk supramolecular adhesive can occur in a solvent-free environment through simple one-step heating, raising the further potential for the creation of multifunctional adhesive materials used in extremely low temperature and ultrahigh vacuum environments, such as cryotherapy area and industrial adhesion in space.