Robust and Highly Conductive PEDOT:PSS:Ag Nanowires/Polyethyleneimine Multilayers Based on Ionic Layer-by-Layer Assembly for E-Textiles and 3D Electronics Robust and Highly Conductive PEDOT:PSS:Ag Nanowires/Polyethyleneimine Multilayers Based on Ionic Layer-by-Layer Assembly for E-Textiles and 3D Electronics AITranslate
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This study shows the production of robust and highly conductive multilayers through the layer-by-layer (LBL) assembly of poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS):Ag nanowires and counterionic compounds, including monomeric tris(2-aminoethyl)amine and chitosan and polyethylenimine (PEI). These materials provide a strong electrostatic interaction with PEDOT:PSS and enable a reliable interface between the layers during the LBL process. Systematic chemical and electrical analyses of the multilayers reveal that the use of PEI results in the highest electrical conductivity (2034 S cm–1 at six LBL cycles) and interfacial adhesion (8.9 mN at the tearing stress). Furthermore, the use of PEI generates a powerful interconnection for electrical circuit patterns with low contact resistance (∼5 Ω) and robust mechanical durability during the water-assisted welding process. Finally, we successfully show the use of this material in electronic textile applications and 3D electronics based on water-assisted welding and transfer printing technology to confirm its feasibility for use in device applications.
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DOI:https://doi.org/10.1021/acsaelm.2c00219
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This study shows the production of robust and highly conductive multilayers through the layer-by-layer (LBL) assembly of poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS):Ag nanowires and counterionic compounds, including monomeric tris(2-aminoethyl)amine and chitosan and polyethylenimine (PEI). These materials provide a strong electrostatic interaction with PEDOT:PSS and enable a reliable interface between the layers during the LBL process. Systematic chemical and electrical analyses of the multilayers reveal that the use of PEI results in the highest electrical conductivity (2034 S cm–1 at six LBL cycles) and interfacial adhesion (8.9 mN at the tearing stress). Furthermore, the use of PEI generates a powerful interconnection for electrical circuit patterns with low contact resistance (∼5 Ω) and robust mechanical durability during the water-assisted welding process. Finally, we successfully show the use of this material in electronic textile applications and 3D electronics based on water-assisted welding and transfer printing technology to confirm its feasibility for use in device applications.
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| GB/T 7714-2015 | [1] Seung Hyun Kim, Heung Cho Ko. ACS Applied Electronic Materials, 2022(4). DOI:10.1021/acsaelm.2c00219. |
| MLA | [1] Seung Hyun Kim, and Heung Cho Ko. ACS Applied Electronic Materials, no. 4, 2022, https://doi.org/10.1021/acsaelm.2c00219. |
| APA | [1] Seung Hyun Kim, & Heung Cho Ko. (2022). ACS Applied Electronic Materials(4). https://doi.org/10.1021/acsaelm.2c00219 |
| IEEE | [1] Seung Hyun Kim and Heung Cho Ko, ACS Applied Electronic Materials, no. 4, 2022, doi: 10.1021/acsaelm.2c00219. keywords: {PEDOT:PSS/PEI multilayers layerbylayer assembly waterassisted welding Etextile 3D electronics} |
