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Assessment of atomic mobilities of Al and Cu in fcc Al–Cu alloys AITranslate

Dandan Liu; Lijun Zhang; Yong Du; Honghui Xu; Shuhong Liu; Libin Liu;
Central South University; Central South University; Central South University; Central South University; Central South University; Central South University
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Publisher: Elsevier
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Abstract AITranslate

Based on various kinds of experimental diffusivities and thermodynamic parameters available in the literature, the atomic mobilities of Al and Cu in face-centered cubic (fcc) Al–Cu alloys have been assessed as a function of temperature and composition by means of DIffusion Controlled TRAnsformation (DICTRA) software package. Comprehensive comparisons between the calculated and measured diffusivities show that most of the experimental data can be well reproduced by the presently obtained atomic mobilities. In addition, the atomic mobilities obtained in the present work can also reasonably predict the concentration profiles for a variety of diffusion couples in fcc Al–Cu alloys including the one prepared in the present work.

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DOI：https://doi.org/10.1016/j.calphad.2009.10.004

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Citation Information:

Based on various kinds of experimental diffusivities and thermodynamic parameters available in the literature, the atomic mobilities of Al and Cu in face-centered cubic (fcc) Al–Cu alloys have been assessed as a function of temperature and composition by means of DIffusion Controlled TRAnsformation (DICTRA) software package. Comprehensive comparisons between the calculated and measured diffusivities show that most of the experimental data can be well reproduced by the presently obtained atomic mobilities. In addition, the atomic mobilities obtained in the present work can also reasonably predict the concentration profiles for a variety of diffusion couples in fcc Al–Cu alloys including the one prepared in the present work.

quote

GB/T 7714-2015 [1] Dandan Liu, Lijun Zhang, Yong Du, et al. Calphad, 2009(33). DOI:10.1016/j.calphad.2009.10.004.
MLA [1] Dandan Liu, et al., Calphad, no. 33, 2009, https://doi.org/10.1016/j.calphad.2009.10.004.
APA [1] Dandan Liu, Lijun Zhang, Yong Du, Honghui Xu, Shuhong Liu, & Libin Liu. (2009). Calphad(33). https://doi.org/10.1016/j.calphad.2009.10.004
IEEE [1] Dandan Liu, Lijun Zhang, Yong Du, Honghui Xu, Shuhong Liu, and Libin Liu, Calphad, no. 33, 2009, doi: 10.1016/j.calphad.2009.10.004.