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Invisible electronics: Metastable Cu-vacancies chain defects for highly conductive p-type transparent oxide AITranslate

Luxembourg Institute of Science and Technology (LIST); Luxembourg Institute of Science and Technology (LIST); Université Paris-Saclay; Luxembourg Institute of Science and Technology (LIST); Luxembourg Institute of Science and Technology (LIST)
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Publisher: Elsevier
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Abstract AITranslate

Non-stoichiometric copper chromium delafossite has lately attracted a high interest in the community of oxide materials due to its high p-type electrical conductivity and adequate transparency in the visible range. This study reports record electrical conductivity of Cu0.66Cr1.33O2 thin films deposited by chemical vapour deposition and investigates their properties. As-deposited samples show conductivities greater than 100 S cm−1 and carrier concentrations around 1021 cm−3, highest reported value for any non-intrinsically doped delafossite system. A new structural defect consisting in Cu-vacancies chains is identified. This defect, never observed or presumed before, heals upon annealing at 900 °C under argon environment, resulting in an electrical conductivity`s reduction of six orders of magnitude. Through a wide-range of structural, chemical and transport measurement techniques, a structure-defect-property correlation of this system is established and the metastability of the non-stoichiometry induced defects is investigated. The possibility of manipulating the defects and carrier concentrations through high-temperature annealing and the outstanding electrical properties associated with the large-scale deposition technique and moderate deposition temperature could be of great technological interest. This material could find important applications as hole injection or extraction layer in all-oxide photovoltaic and light emitting devices. Graphical abstract Download : Download high-res image (187KB) Download : Download full-size image

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DOI:https://doi.org/10.1016/j.apmt.2017.07.004

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Non-stoichiometric copper chromium delafossite has lately attracted a high interest in the community of oxide materials due to its high p-type electrical conductivity and adequate transparency in the visible range. This study reports record electrical conductivity of Cu0.66Cr1.33O2 thin films deposited by chemical vapour deposition and investigates their properties. As-deposited samples show conductivities greater than 100 S cm−1 and carrier concentrations around 1021 cm−3, highest reported value for any non-intrinsically doped delafossite system. A new structural defect consisting in Cu-vacancies chains is identified. This defect, never observed or presumed before, heals upon annealing at 900 °C under argon environment, resulting in an electrical conductivity`s reduction of six orders of magnitude. Through a wide-range of structural, chemical and transport measurement techniques, a structure-defect-property correlation of this system is established and the metastability of the non-stoichiometry induced defects is investigated. The possibility of manipulating the defects and carrier concentrations through high-temperature annealing and the outstanding electrical properties associated with the large-scale deposition technique and moderate deposition temperature could be of great technological interest. This material could find important applications as hole injection or extraction layer in all-oxide photovoltaic and light emitting devices. Graphical abstract Download : Download high-res image (187KB) Download : Download full-size image

quote

GB/T 7714-2015 [1] Petru Lunca Popa, Jonathan Crêpellière, Pavan Nukala, et al. Applied Materials Today, 2017(9). DOI:10.1016/j.apmt.2017.07.004.
MLA [1] Petru Lunca Popa, et al., Applied Materials Today, no. 9, 2017, https://doi.org/10.1016/j.apmt.2017.07.004.
APA [1] Petru Lunca Popa, Jonathan Crêpellière, Pavan Nukala, Renaud Leturcq, & Damien Lenoble. (2017). Applied Materials Today(9). https://doi.org/10.1016/j.apmt.2017.07.004
IEEE [1] Petru Lunca Popa, Jonathan Crêpellière, Pavan Nukala, Renaud Leturcq, and Damien Lenoble, Applied Materials Today, no. 9, 2017, doi: 10.1016/j.apmt.2017.07.004.