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Memory Devices Based on Van der Waals Heterostructures AITranslate

Fudan University; Fudan University
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Publisher: ACS
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Abstract AITranslate

With a rapid increase in artificial intelligence applications, massive data need to be processed in parallel and the performance of memories becomes the key factor that limits the efficiency of the whole system. High-performance memories that match the high-speed computing cell is needed, and architecture innovation is also urgent to solve the data transfer bottleneck of von Neumann architecture. Constructed by layered two-dimensional (2D) materials, van der Waals (vdW) heterostructures can be easily stacked and own diverse physical properties and band structures that provide a large space for the memory devices design. In this Perspective, we offer a perspective on the field of vdW heterostructures memory devices, including the device performance enhancement, the mechanism innovation, and the rich application scenarios.

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DOI:https://doi.org/10.1021/acsmaterialslett.0c00227

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Citation Information:

With a rapid increase in artificial intelligence applications, massive data need to be processed in parallel and the performance of memories becomes the key factor that limits the efficiency of the whole system. High-performance memories that match the high-speed computing cell is needed, and architecture innovation is also urgent to solve the data transfer bottleneck of von Neumann architecture. Constructed by layered two-dimensional (2D) materials, van der Waals (vdW) heterostructures can be easily stacked and own diverse physical properties and band structures that provide a large space for the memory devices design. In this Perspective, we offer a perspective on the field of vdW heterostructures memory devices, including the device performance enhancement, the mechanism innovation, and the rich application scenarios.

quote

GB/T 7714-2015 [1] Chunsen Liu, Peng Zhou. ACS Materials Letters, 2020(2). DOI:10.1021/acsmaterialslett.0c00227.
MLA [1] Chunsen Liu, and Peng Zhou. ACS Materials Letters, no. 2, 2020, https://doi.org/10.1021/acsmaterialslett.0c00227.
APA [1] Chunsen Liu, & Peng Zhou. (2020). ACS Materials Letters(2). https://doi.org/10.1021/acsmaterialslett.0c00227
IEEE [1] Chunsen Liu and Peng Zhou, ACS Materials Letters, no. 2, 2020, doi: 10.1021/acsmaterialslett.0c00227.