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Technological Evolution of Image Sensing Designed by Nanostructured Materials AITranslate

Zhejiang University; University of the Punjab; Vietnam|Vietnam National University; The University of Lahore; Balochistan University of Information Technology; The University of Lahore; The University of Lahore; The University of Lahore; Al-Mustaqbal University College; King Khalid University; Ho Chi Minh City University of Technology and Education; National Sun Yat-sen University; National Sun Yat-Sen University
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Publisher: ACS
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Abstract AITranslate

Imaging sensing holds a remarkable place in modern electronics and optoelectronics for the complementary metal-oxide-semiconductor integration of high-speed optical communications and photodetection with the merits of high-speed operation, cost-effectiveness, and noncomplex fabrication. The optimum quality of image sensing relies on noise, sensitivity, power consumption, voltage operation, and speed imaging to access and compete with the state-of-the-art image sensing devices in the industry. Many studies have been conducted to address these issues; however, performance has not yet been optimized and solutions are still in the works.

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DOI:https://doi.org/10.1021/acsmaterialslett.2c01011

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Citation Information:

Imaging sensing holds a remarkable place in modern electronics and optoelectronics for the complementary metal-oxide-semiconductor integration of high-speed optical communications and photodetection with the merits of high-speed operation, cost-effectiveness, and noncomplex fabrication. The optimum quality of image sensing relies on noise, sensitivity, power consumption, voltage operation, and speed imaging to access and compete with the state-of-the-art image sensing devices in the industry. Many studies have been conducted to address these issues; however, performance has not yet been optimized and solutions are still in the works.

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GB/T 7714-2015 [1] Muhammad Aamir Iqbal, Maria Malik, Top Khac Le, et al. ACS Materials Letters, 2023(5). DOI:10.1021/acsmaterialslett.2c01011.
MLA [1] Muhammad Aamir Iqbal, et al., ACS Materials Letters, no. 5, 2023, https://doi.org/10.1021/acsmaterialslett.2c01011.
APA [1] Muhammad Aamir Iqbal, Maria Malik, Top Khac Le, Nadia Anwar, Sunila Bakhsh, Wajeehah Shahid, Samiah Shahid, Shaheen Irfan, Mohammed AlBahrani, Kareem Morsy, HuyBinh Do, Vinoth Kumar Ponnusamy, & Phuong V. Pham. (2023). ACS Materials Letters(5). https://doi.org/10.1021/acsmaterialslett.2c01011
IEEE [1] Muhammad Aamir Iqbal, Maria Malik, Top Khac Le, Nadia Anwar, Sunila Bakhsh, Wajeehah Shahid, Samiah Shahid, Shaheen Irfan, Mohammed AlBahrani, Kareem Morsy, HuyBinh Do, Vinoth Kumar Ponnusamy, and Phuong V. Pham, ACS Materials Letters, no. 5, 2023, doi: 10.1021/acsmaterialslett.2c01011.