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Fluorinated Benzocyclobutene-Based Low-k Polymer at High Frequency AITranslate

University of Chinese Academy of Sciences; University of Chinese Academy of Sciences; University of Chinese Academy of Sciences
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Publisher: ACS
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Abstract AITranslate

Through the Heck reaction, a fluorinated monomer with cross-linkable substituted vinyl and benzocyclobutene groups has been successfully synthesized. Treating this monomer at elevated temperatures results in a cross-linked polymer, exhibiting favorable dielectric properties with a permittivity (Dk) of 2.53 and a dielectric loss (Df) of 2.18 × 10–3 at a frequency of 5 GHz. Such good dielectric properties are maintained, even when the polymer is immersed in boiling water for up to 96 h. The polymer also exhibits good thermal stability with a glass transition temperature (Tg) of 263 °C as well as a coefficient of thermal expansion (CTE) of 79 ppm/°C. These data manifest that the monomer is appropriate for its use as a precursor for encapsulation resins for the manufacture of devices used in the field of high-frequency communication.

KeyWords AITranslate

dielectric properties fluorocontaining polymers benzocyclobutenebased polymers highfrequency communication high Show More
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Basic Information:

DOI:https://doi.org/10.1021/acsapm.1c01337

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Citation Information:

Through the Heck reaction, a fluorinated monomer with cross-linkable substituted vinyl and benzocyclobutene groups has been successfully synthesized. Treating this monomer at elevated temperatures results in a cross-linked polymer, exhibiting favorable dielectric properties with a permittivity (Dk) of 2.53 and a dielectric loss (Df) of 2.18 × 10–3 at a frequency of 5 GHz. Such good dielectric properties are maintained, even when the polymer is immersed in boiling water for up to 96 h. The polymer also exhibits good thermal stability with a glass transition temperature (Tg) of 263 °C as well as a coefficient of thermal expansion (CTE) of 79 ppm/°C. These data manifest that the monomer is appropriate for its use as a precursor for encapsulation resins for the manufacture of devices used in the field of high-frequency communication.

quote

GB/T 7714-2015 [1] Fengping Liu, Jing Sun, Qiang Fang. ACS Applied Polymer Materials, 2022(4). DOI:10.1021/acsapm.1c01337.
MLA [1] Fengping Liu, et al., ACS Applied Polymer Materials, no. 4, 2022, https://doi.org/10.1021/acsapm.1c01337.
APA [1] Fengping Liu, Jing Sun, & Qiang Fang. (2022). ACS Applied Polymer Materials(4). https://doi.org/10.1021/acsapm.1c01337
IEEE [1] Fengping Liu, Jing Sun, and Qiang Fang, ACS Applied Polymer Materials, no. 4, 2022, doi: 10.1021/acsapm.1c01337. keywords: {dielectric properties;fluorocontaining polymers;benzocyclobutenebased polymers;highfrequency communication;high;Show More}