daohang fenxiangbox searchbox qikanlogonew daohangnew searchboxnew navrightzone footerzone paper

Multi-scale cold embossing of CoCrFeNiMn high entropy alloy with ultra-high temperature durability AITranslate

Shenzhen University; Shenzhen University; Shenzhen University; Shenzhen University; Shenzhen University; Shenzhen University; Shenzhen University; Shenzhen University; Shenzhen University
AITranslate
Publisher: Elsevier
Share Citation Information Add to Favorites

    Scan to share on WeChat or Moments

Use WeChat scan.
Share with WeChat friends or Moments

Abstract AITranslate

Ultra-precision machining and forming of metallic materials is of great significance in the fields of catalysts, sensors, and biomedical devices. In present work, the multi-scale cold embossing of CoCrFeNiMn high entropy alloy (HEA) with structures ranging from macro-scale to nano-scale was investigated at room temperature. In less 7 s, the macro patterns, the shapes of Arabic numerals, 5 μm wide gratings, 30 μm diameter hemispherical arrays, and ∼270 nm nanowires were formed rapidly. The highest replication of the HEA cold embossing was up to 98%. A series of slip bands were detected in the cold embossed HEA structures, which can accommodate more dislocations and facilitate the plastic deformation process. Moreover, dislocation pile-up and large angular rotation within grains are observed in the deformation areas, which is favorable to contain dislocation cells, leading to grain refinement and an increase in hardness. In addition, the multi-scale HEA can be used as a high-temperature resistant mold for forming thermoplastic materials such as plastics and metallic glasses at temperatures up to 900 °C. Our researches provide candidate materials and novel methods for the facile preparation and various applications of hyperfine structures. Graphical abstract Download : Download high-res image (219KB) Download : Download full-size image

KeyWords AITranslate

No data

Basic Information:

DOI:https://doi.org/10.1016/j.apmt.2021.101233

Chinese Library Classification Number:

Citation Information:

Ultra-precision machining and forming of metallic materials is of great significance in the fields of catalysts, sensors, and biomedical devices. In present work, the multi-scale cold embossing of CoCrFeNiMn high entropy alloy (HEA) with structures ranging from macro-scale to nano-scale was investigated at room temperature. In less 7 s, the macro patterns, the shapes of Arabic numerals, 5 μm wide gratings, 30 μm diameter hemispherical arrays, and ∼270 nm nanowires were formed rapidly. The highest replication of the HEA cold embossing was up to 98%. A series of slip bands were detected in the cold embossed HEA structures, which can accommodate more dislocations and facilitate the plastic deformation process. Moreover, dislocation pile-up and large angular rotation within grains are observed in the deformation areas, which is favorable to contain dislocation cells, leading to grain refinement and an increase in hardness. In addition, the multi-scale HEA can be used as a high-temperature resistant mold for forming thermoplastic materials such as plastics and metallic glasses at temperatures up to 900 °C. Our researches provide candidate materials and novel methods for the facile preparation and various applications of hyperfine structures. Graphical abstract Download : Download high-res image (219KB) Download : Download full-size image

quote

GB/T 7714-2015 [1] Wenxin Wen, Zhiyuan Huang, Zhen Li, et al. Applied Materials Today, 2021(25). DOI:10.1016/j.apmt.2021.101233.
MLA [1] Wenxin Wen, et al., Applied Materials Today, no. 25, 2021, https://doi.org/10.1016/j.apmt.2021.101233.
APA [1] Wenxin Wen, Zhiyuan Huang, Zhen Li, Jianan Fu, Wenqing Ruan, Shuai Ren, Zhenxuan Zhang, Xiong Liang, & Jiang Ma. (2021). Applied Materials Today(25). https://doi.org/10.1016/j.apmt.2021.101233
IEEE [1] Wenxin Wen, Zhiyuan Huang, Zhen Li, Jianan Fu, Wenqing Ruan, Shuai Ren, Zhenxuan Zhang, Xiong Liang, and Jiang Ma, Applied Materials Today, no. 25, 2021, doi: 10.1016/j.apmt.2021.101233.