High-Flexible Phase Change Composites with Enhanced Thermal Conductivity for Electronic Thermal Management AITranslate

Basic Information:

DOI：https://doi.org/10.1021/acsapm.3c02404

Chinese Library Classification Number:

Citation Information:

High thermal conductivity and outstanding flexibility are highly desired for thermal management applications of phase change materials (PCMs) in flexible and wearable electronics. Herein, a shape-stabilized and flexible phase change composite film with binary heat-conducting fillers of boron nitride and graphene nanoflakes was prepared by a facile strategy through a water-based emulsion blending method. Benefiting from the honeycomb-like distribution of binary fillers in polymer-based flexible PCMs, the as-prepared composite exhibits a high thermal conductivity of 1.09 W/m·K and an outstanding extensibility (275%). Meanwhile, it also possesses relatively high latent heat (96.88 J/g) and good thermal and shape stability. Based on the remarkable comprehensive performances, the obtained honeycomb-like structured composite PCM films show great prospects in the thermal management of next-generation flexible electronics.